MTU Cork Library Catalogue

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Modern solder technology for competitive electronics manufacturing / Jennie S. Hwang.

by Hwang, Jennie S.

Material type: book Book; Format: print Publisher: New York : McGraw-Hill, 1996Availability: Items available for loan: MTU Bishopstown Library (2). Location(s): Lending 621.381046.
Electronic packaging and interconnection handbook / edited by Charles A. Harper.

by Harper, Charles A.

Edition: 2nd ed.Material type: book Book; Format: print Publisher: New York : McGraw-Hill, 1997Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Lending 621.381046.
Materials for electronic packaging / edited by Deborah D.L. Chung.

by Chung, Deborah D. L.

Material type: book Book; Format: print Publisher: Boston : Butterworth-Heinemann, 1995Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Lending 621.381046.
Semiconductor packaging : a multidisciplinary approach / edited by Robert J. Hannermann, Allan D. Kraus and Michael Pecht.

by Hannermann, Robert J | Kraus, Allan D | Pecht, Michael.

Material type: book Book; Format: print Publisher: London ; New York : Wiley-Interscience, 1997Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Lending 621.381046.
The Electronics assembly handbook / edited by Frank Riley and the staff of Electronic packaging and production.

by Riley, Frank J.

Material type: book Book Publisher: Bedford, U.K. : Berlin ; New York : IFS Publications ; Springer-Verlag, 1988Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Lending 621.3815.
Newnes electronics assembly pocket book / Keith Brindley.

by Brindley, Keith.

Material type: book Book Publisher: Oxford : BH Newnes, 1991Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Lending 621.3815.
Electronic packaging : design, materials, process, and reliability / John H. Lau ... [et al.].

by Lau, John H | Prince, John L, 1941- | Nakayama, Wataru.

Material type: book Book; Format: print Publisher: New York ; London : McGraw-Hill, 1998Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Lending 621.381046.
The handbook of machine soldering : SMT and TH / Ralph W. Woodgate.

by Woodgate, Ralph W, 1922-.

Edition: 3rd ed.Material type: book Book; Format: print Publisher: New York ; Chichester : Wiley, 1996Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Lending 621.381046.
Electronic packaging : materials and their properties / Michael G. Pecht ... [et al.].

by Pecht, Michael.

Material type: book Book; Format: print Publisher: Boca Raton : CRC Press, 1999Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Lending 621.381046.
Newnes electronics assembly handbook / Keith Brindley.

by Brindley, Keith.

Material type: book Book; Format: print Publisher: Oxford : Newnes, 1993Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Lending 621.3815.
Reflow soldering processes : SMT, BGA, CSP, and flip chip technologies / Ning-Cheng Lee.

by Lee, Ning-Cheng.

Material type: book Book; Format: print ; Literary form: Not fiction Publisher: Boston, Mass. : Newnes, 2001Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Lending 621.381.
Twenty sixth IEEE/CPMT International Electronics Manufacturing Technology Sympoisum : proceedings of the 2000 IEMT Symposium held in Santa Clara California, October 2-3, 2000 / sponsored by Semiconductor Equipment and Materials.

by IEEE/CPMT International Electronics Manufacturing Technology Symposium (26th : 2000 : Santa Clara, California) | Semiconductor Equipment and Materials International.

Material type: book Book; Format: print Publisher: Piscataway, NJ : IEEE, 2000Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Lending 621.381.
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