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Twenty sixth IEEE/CPMT International Electronics Manufacturing Technology Sympoisum : proceedings of the 2000 IEMT Symposium held in Santa Clara California, October 2-3, 2000 / sponsored by Semiconductor Equipment and Materials.

By: (26th : IEEE/CPMT International Electronics Manufacturing Technology Symposium (26th : 2000 : Santa Clara, California).
Contributor(s): Semiconductor Equipment and Materials International.
Material type: materialTypeLabelBookPublisher: Piscataway, NJ : IEEE, 2000Description: v, 388 p. : ill ; 28 cm. + pbk.ISBN: 0780364821.ISSN: 10898190.Subject(s): Electronic industries -- Congresses | Production engineering -- Congresses | Electronic apparatus and appliances -- Design and construction -- Congresses | Semiconductors -- Design and construction -- Congresses | Electronic packaging -- CongressesDDC classification: 621.381
Contents:
Session 1: Systems specific packaging technologies -- Session 2: Package & system modeling -- Session 3: Emerging trends in semiconductor packaging -- Session 4: Package reliability -- Session 4: Package reliability (Con\'t) -- Session 5: Package assembly -- Session 6: Environmentally friendly electronics manufacturing lead-free, halogen-free and solder alternatives -- Session 7: Flip chip array packaging -- Session 8: Electronics and semiconductor manufacturing optimization.
Holdings
Item type Current library Call number Copy number Status Date due Barcode Item holds
General Lending MTU Bishopstown Library Lending 621.381 (Browse shelf(Opens below)) 1 Available 00092181
Total holds: 0

IEEE catalog number 00CH37146--T.p. verso.

Includes bibliographical references.

Session 1: Systems specific packaging technologies -- Session 2: Package & system modeling -- Session 3: Emerging trends in semiconductor packaging -- Session 4: Package reliability -- Session 4: Package reliability (Con\'t) -- Session 5: Package assembly -- Session 6: Environmentally friendly electronics manufacturing lead-free, halogen-free and solder alternatives -- Session 7: Flip chip array packaging -- Session 8: Electronics and semiconductor manufacturing optimization.

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