Materials for electronic packaging / edited by Deborah D.L. Chung.
Contributor(s): Chung, Deborah D. L
.
Material type: 
BookPublisher: Boston : Butterworth-Heinemann, 1995Description: xiv, 368 p. : ill. ; 24 cm. + hbk.ISBN: 0750693142.Subject(s): Electronic packaging -- MaterialsDDC classification: 621.381046 | Item type | Current library | Call number | Copy number | Status | Date due | Barcode | Item holds |
|---|---|---|---|---|---|---|---|
| General Lending | MTU Bishopstown Library Lending | 621.381046 (Browse shelf(Opens below)) | 1 | Available | 00069010 |
Enhanced descriptions from Syndetics:
Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective.
The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems.
Includes bibliographical references and index.
Part I: Overview -- Overview of materials for electronic packaging / D. D. L. Chung -- Part II: Joining -- Solderability fundamentals: microscopic processes / J. A. Clum, T. J. Singler -- Determining the damaging strains which cause failure in Pb-Sn solders / A. I. Attarwala, B. C. Hendrix, J. M. Sanchez -- Fluxless soldering for microelectronic applications / D. R. Frear, F. M. Hosking, D. M. Keicher, H. C. Peebles -- The effect of microstructure on fracture of metal/ceramic interfaces / Ivar E. Reimanis -- Part III: Composites -- The future of advanced composite electronic packaging / Carl Zweben -- Low thermal expansion composite materials for electronic packaging / D. D. L. Chung -- Conducting polymer-matrix composites / D. D. L. Chung, Lin Li -- Part IV: Metal films -- Thick film technology / Rene E. Cote -- Electroless copper for micropackaging and ultralarge-scale integrated circuit applications / Y. Shacham-Diamand -- Vacuum metallization for integrated circuit packages / K. J. Blackwell, P. C. Chen, A. R. Knoll, J. J. Cuomo -- Part V: Polymers and other materials -- Silicon-based polymers in electronic packaging / C. P. Wong -- Dielectric films for high temperature, high voltage power electronics / Javaid R. Laghari, Jayant L. Suthar -- Electrically conducting polymers and organic materials / M. J. Naughton -- Diamond in electronic packages / D. J. Pickrell, D. S. Hoover -- Part VI: Materials testing -- Measurements of properties of materials in electronic packaging / Joseph A. Carpenter, Jr.
Table of contents provided by Syndetics
- Overview of materials for electronic packaging
- Solderability fundamentals: role of microscopic processes
- Determining the damaging strains which cause failure in lead tin solders
- Fluxless soldering for microelectronic applications, The effect of microstructure on the bonding of metal/ceramic interfaces
- The future of advanced composite electronic packaging
- Low thermal expansion composite materials for electronic packaging
- Electrically conducting polymer-matrix composites
- Thick-film technology
- Electroless copper for micropackaging and ultra large scale integrated circuit applications
- Vacuum metallization for integrated circuit packages
- Electrically conducting polymers and organic materials
- Diamond films
- Measurements of properties of materials in electronic packaging