Results of search for 'su:"Packaging"'

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		Modern solder technology for competitive electronics manufacturing / Jennie S. Hwang. by Hwang, Jennie S. Material type: Book; Format: print Publisher: New York : McGraw-Hill, 1996Availability: Items available for loan: MTU Bishopstown Library (2). Location(s): Lending 621.381046. Place hold Add to cart (remove)
		Packaging / Rockport Publishers. Material type: Book; Format: print Publisher: Rockport, MA : Rockport Publishers, 1995Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Store Item 688.8. Place hold Add to cart (remove)
		Electronic packaging and interconnection handbook / edited by Charles A. Harper. by Harper, Charles A. Edition: 2nd ed.Material type: Book; Format: print Publisher: New York : McGraw-Hill, 1997Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Lending 621.381046. Place hold Add to cart (remove)
		Materials for electronic packaging / edited by Deborah D.L. Chung. by Chung, Deborah D. L. Material type: Book; Format: print Publisher: Boston : Butterworth-Heinemann, 1995Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Lending 621.381046. Place hold Add to cart (remove)
		Semiconductor packaging : a multidisciplinary approach / edited by Robert J. Hannermann, Allan D. Kraus and Michael Pecht. by Hannermann, Robert J \| Kraus, Allan D \| Pecht, Michael. Material type: Book; Format: print Publisher: London ; New York : Wiley-Interscience, 1997Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Lending 621.381046. Place hold Add to cart (remove)
		The Electronics assembly handbook / edited by Frank Riley and the staff of Electronic packaging and production. by Riley, Frank J. Material type: Book Publisher: Bedford, U.K. : Berlin ; New York : IFS Publications ; Springer-Verlag, 1988Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Lending 621.3815. Place hold Add to cart (remove)
		No cover image available An introduction to digital prepress for flexography and packaging / Agfa. by Aktiengesellschaft fur̈ Anilinfabrikation. Material type: Book; Format: print Publisher: Middlesex : Agfa-Gevaert, 1997Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Lending 688.8. Place hold Add to cart (remove)
		The Wiley encyclopedia of packaging technology / edited by Aaron L. Brody and Kenneth S. Marsh. by Marsh, Kenneth S. Edition: 2nd ed.Material type: Book; Format: print Publisher: New York : Wiley, 1997Availability: Items available for reference: MTU Bishopstown Library [Call number: 688.803] (1). Location(s): Reference 688.803. Add to cart (remove)
		Flexible packaging of foods / author, Aaron L. Brody. by Brody, Aaron L. Material type: Book Publisher: London : Butterworths, 1970Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Store Item 664.09. Place hold Add to cart (remove)
		Package design : an introduction to the art of packaging / Laszlo Roth. by Roth, Lászlo. Material type: Book Publisher: Englewood Cliffs, N.J. : Prentice-Hall, 1981Availability: Items available for loan: MTU Crawford College of Art and Design Library (1). Location(s): Lending 688.8. Place hold Add to cart (remove)
		The packaging designer's book of patterns / Laszlo Roth and George L. Wybenga. by Roth, Lászlo \| Wybenga, George L. Material type: Book; Format: print Publisher: Chichester : Wiley, 1991Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Lending 688.8. Place hold Add to cart (remove)
		Newnes electronics assembly pocket book / Keith Brindley. by Brindley, Keith. Material type: Book Publisher: Oxford : BH Newnes, 1991Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Lending 621.3815. Place hold Add to cart (remove)
		Chip scale package (CSP) : design, materials, processes, reliability, and applications / John H. Lau and Shi-Wei Ricky Lee. by Lau, John H \| Lee, Shi-Wei Ricky. Material type: Book; Format: print Publisher: New York ; London : McGraw-Hill, c1999Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Lending 621.3815. Place hold Add to cart (remove)
		Electronic packaging : design, materials, process, and reliability / John H. Lau ... [et al.]. by Lau, John H \| Prince, John L, 1941- \| Nakayama, Wataru. Material type: Book; Format: print Publisher: New York ; London : McGraw-Hill, 1998Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Lending 621.381046. Place hold Add to cart (remove)
		Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies / John H. Lau. by Lau, John H. Material type: Book; Format: print Publisher: New York ; London : McGraw-Hill, 2000Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Lending 621.3815. Place hold Add to cart (remove)
		The handbook of machine soldering : SMT and TH / Ralph W. Woodgate. by Woodgate, Ralph W, 1922-. Edition: 3rd ed.Material type: Book; Format: print Publisher: New York ; Chichester : Wiley, 1996Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Lending 621.381046. Place hold Add to cart (remove)
		Electronic packaging : materials and their properties / Michael G. Pecht ... [et al.]. by Pecht, Michael. Material type: Book; Format: print Publisher: Boca Raton : CRC Press, 1999Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Lending 621.381046. Place hold Add to cart (remove)
		Microelectronic packaging : a bibliography / compiled by A. H. Agajanian. by Agajanian, A. H. Material type: Book Publisher: New York : IFI/Plenum, c1979Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Store Item 621.381. Place hold Add to cart (remove)
		Fundamentals of packaging technology / Walter Soroka, Anne Emblem and Henry Emblem. by Soroka, W \| Emblem, Anne \| Emblem, Henry. Material type: Book; Format: print Publisher: Leicestershire : Institute of Packaging, 1996Availability: Items available for loan: MTU Bishopstown Library (2). Location(s): Store Item 688.8. Place hold Add to cart (remove)
		How to wrap five more eggs : traditional Japanese packaging / Hideyuki Oka. by Oka, Hideyuki, 1905-1995 [author]. Material type: Book; Literary form: Not fiction Publisher: New York : Weatherhill, 1975Availability: Items available for loan: MTU Crawford College of Art and Design Library (1). Location(s): Lending 745.54. Place hold Add to cart (remove)

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Your search returned 27 results.