Enhanced descriptions from Syndetics:

MEMS technology and applications have grown at a tremendous pace, while structural dimensions have grown smaller and smaller, reaching down even to the molecular level. With this movement have come new types of applications and rapid advances in the technologies and techniques needed to fabricate the increasingly miniature devices that are literally changing our world.

A bestseller in its first edition, Fundamentals of Microfabrication, Second Edition reflects the many developments in methods, materials, and applications that have emerged recently. Renowned author Marc Madou has added exercise sets to each chapter, thus answering the need for a textbook in this field.

Fundamentals of Microfabrication, Second Edition offers unique, in-depth coverage of the science of miniaturization, its methods, and materials. From the fundamentals of lithography through bonding and packaging to quantum structures and molecular engineering, it provides the background, tools, and directions you need to confidently choose fabrication methods and materials for a particular miniaturization problem.

New in the Second Edition
Revised chapters that reflect the many recent advances in the field
Updated and enhanced discussions of topics including DNA arrays, microfluidics, micromolding techniques, and nanotechnology
In-depth coverage of bio-MEMs, RF-MEMs, high-temperature, and optical MEMs.
Many more links to the Web
Problem sets in each chapter

Table of contents provided by Syndetics

• Chapter 1 Lithography (p. 1)
• Introduction (p. 1)
• Historical Note: Lithography's Origins (p. 1)
• Photolithography Overview (p. 2)
• Critical Dimension, Overall Resolution, Line Width (p. 14)
• Lithographic Sensitivity and Intrinsic Resist Sensitivity (Photochemical Quantum Efficiency) (p. 14)
• Resist Profiles (p. 16)
• Contrast and Experimental Determination of Lithographic Sensitivity (p. 19)
• Resolution in Photolithography (p. 21)
• Photolithography Resolution Enhancement Technology (p. 32)
• Beyond Moore's Law (p. 44)
• Next-Generation Lithographies (p. 48)
• Emerging Lithography Technologies (p. 58)
• Examples (p. 68)
• Problems (p. 70)
• References (p. 71)
• Chapter 2 Pattern Transfer with Dry Etching Techniques (p. 77)
• Introduction (p. 77)
• Dry Etching: Definitions and Jargon (p. 78)
• Plasmas or Discharges (p. 79)
• Physical Etching: Ion Etching or Sputtering and Ion-Beam Milling (p. 88)
• Plasma Etching (Radical Etching) (p. 93)
• Physical/Chemical Etching (p. 97)
• Deep Reactive Ion Etching (DRIE) (p. 104)
• Vapor-Phase Etching without Plasma (XeF[subscript 2]) (p. 107)
• Dry Etching Models--In Situ Monitoring (p. 108)
• Comparing Wet and Dry Etching (p. 110)
• Examples (p. 110)
• Problems (p. 116)
• References (p. 118)
• Chapter 3 Pattern Transfer with Additive Techniques (p. 123)
• Introduction (p. 123)
• Silicon Growth (p. 125)
• Doping of Si (p. 127)
• Oxidation of Silicon (p. 131)
• Physical Vapor Deposition (p. 134)
• Chemical Vapor Deposition (p. 144)
• Silk-Screening or Screen Printing (p. 154)
• Sol-Gel Deposition Technique (p. 156)
• Doctor's Blade or Tape Casting (p. 157)
• Plasma Spraying (p. 157)
• Deposition and Arraying Methods of Organic Layers in BIOMEMS (p. 159)
• Thin vs. Thick Film Deposition (p. 168)
• Selection Criteria for Deposition Method (p. 170)
• Examples (p. 170)
• Problems (p. 174)
• References (p. 178)
• Chapter 4 Wet Bulk Micromachining (p. 183)
• Introduction (p. 183)
• Historical Note (p. 184)
• Silicon Crystallography (p. 185)
• Silicon as Substrate (p. 193)
• Silicon as a Mechanical Element in MEMS (p. 195)
• Other Si Sensor Properties (p. 204)
• Wet Isotropic and Anisotropic Etching (p. 206)
• Etching with Bias and/or Illumination of the Semiconductor (p. 228)
• Etch-Stop Techniques (p. 232)
• Issues in Wet Bulk Micromachining (p. 239)
• Computer Simulation Software (p. 245)
• Examples (p. 245)
• Problems (p. 250)
• References (p. 251)
• Chapter 5 Surface Micromachining (p. 259)
• Introduction (p. 259)
• Historical Note (p. 260)
• Mechanical Properties of Thin Films (p. 261)
• Surface Micromachining Processes (p. 272)
• Poly-Si Surface Micromachining Modifications (p. 283)
• Surface Micromachining Modifications Not Involving Polysilicon (p. 287)
• Comparison of Bulk Micromachining with Surface Micromachining (p. 292)
• Materials Case Studies (p. 293)
• Examples (p. 306)
• Problems (p. 313)
• References (p. 315)
• Chapter 6 Liga and Micromolding (p. 325)
• Introduction (p. 325)
• Liga--Background (p. 325)
• Liga and Liga-Like Process Steps (p. 330)
• Examples (p. 369)
• Problems (p. 371)
• References (p. 373)
• Chapter 7 A Comparison of Miniaturization Techniques: Top-Down and Bottom-Up Manufacturing (p. 379)
• Introduction (p. 379)
• Absolute and Relative Tolerance in Manufacturing (p. 380)
• Historical Note: Human Manufacturing (p. 381)
• Section I Top-Down Manufacturing Methods (p. 385)
• Section II Bottom-Up Approaches (p. 423)
• Examples (p. 456)
• Problems (p. 458)
• References (p. 460)
• Chapter 8 Modeling, Brains, Packaging, Sample Preparation, and Substrate Choice (p. 467)
• Introduction (p. 467)
• Modeling (p. 468)
• Brains in MEMS (p. 473)
• Packaging (p. 478)
• Sample Preparation in Molecular Diagnostics (p. 512)
• Substrate Choice (p. 518)
• Examples (p. 522)
• Problems (p. 523)
• References (p. 524)
• Chapter 9 Scaling, Actuators, and Power in Miniaturized Systems (p. 535)
• Introduction (p. 535)
• Scaling (p. 536)
• Actuators (p. 547)
• Fluidics (p. 579)
• Thermal Actuators (p. 587)
• Scaling in Analytical Separation Equipment (p. 593)
• Other Actuators (p. 600)
• Power in MEMS (p. 600)
• Examples (p. 602)
• Problems (p. 605)
• References (p. 606)
• Chapter 10 Miniaturization Applications (p. 615)
• Introduction (p. 615)
• Definitions and Classification Method (p. 616)
• Decision Tree (p. 621)
• Overall Market for Micromachines (p. 624)
• MEMS in the Automotive Market (p. 630)
• MEMS in Medical and Biomedical Markets (p. 639)
• Environmental Monitoring (p. 650)
• Industrial/Automation (p. 655)
• IT/Peripheral (p. 658)
• Telecommunications (p. 661)
• Problems (p. 664)
• References (p. 666)
• Appendix A Metrology Techniques for MEMS (p. 669)
• Appendix B Living Book (p. 671)
• Appendix C Si and SiO[subscript 2] Etch Rates in KOH (p. 673)
• Appendix D Genetics (p. 675)
• The 20 Amino Acids Found in Biological Systems (p. 675)
• The Genetic Code (p. 677)
• Appendix E Suggested Further Reading (p. 679)
• Books on Top-Down and Bottom-Up Miniaturization (p. 679)
• Journals and Periodicals on Micromachining and Sensors (p. 682)
• Series on Micromachining and Sensors (p. 682)
• Market Studies on Micromachining and Sensors (p. 683)
• Important Proceedings/Conferences on Micromachining and Sensors (p. 683)
• Appendix F MEMS Companies (p. 685)
• Appendix G Glossary (p. 687)
• Index (p. 703)