Modern solder technology for competitive electronics manufacturing / Jennie S. Hwang.
By: Hwang, Jennie S
.
Material type: 
BookSeries: Electronic packaging and interconnection series.Publisher: New York : McGraw-Hill, 1996Description: xliv, 622 p. : ill. ; 24 cm. + hbk.ISBN: 0070317496 .Subject(s): Electronic packaging | Solder and solderingDDC classification: 621.381046
| Item type | Current library | Call number | Copy number | Status | Date due | Barcode | Item holds |
|---|---|---|---|---|---|---|---|
| General Lending | MTU Bishopstown Library Lending | 621.381046 (Browse shelf(Opens below)) | 1 | Available | 00017946 | ||
| General Lending | MTU Bishopstown Library Lending | 621.381046 (Browse shelf(Opens below)) | 1 | Available | 00017947 |
Enhanced descriptions from Syndetics:
Solder is the common interconnecting material for electronic packaging and assembly, providing electrical, thermal and mechanical functions. This text provides coverage of all relevant technologies related to the applications of solder, covering the fundamental principles involved in each process, but also relating those principles to the execution of practical applications. It also provides the working solder knowledge needed to implement an electronic manufacturing system using any of the new technologies available.
Includes bibliographical references and index.
Table of contents provided by Syndetics
- Introduction
- Advanced Surface Mount Technology and Die Attach Techniques
- Solder Material
- Soldering Chemistry
- Solderability
- Microstructure of Solders
- Aqueous-Cleaning Manufacture
- No-Clean Manufacture
- Protective and Reactive Atmosphere Soldering
- Surface Mount Fine Pitch Technology
- Surface Mount-BGA/PAC Technology
- Soldering Methodology and Equipment
- Soldering and Soldering Related Issues
- Strengthened Solders
- Lead-Free Solders
- Solder Joint Failure Mode
- Solder Joint Failure Assessment-Case Studies
- Solder Joint Quality and Reliability
- New and Emerging Specifications and Standards
- Future Trends