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		Soldering manual / prepared by AWS Committee on Brazing and Soldering under the direction of AWS Technical Activities Committee ; approved by AWS Board of Directors, April 1, 1977. by American Welding Society. Committee on Brazing and Soldering \| American Welding Society. Technical Activities Committee. Edition: 2d ed. / rev.Material type: Book Publisher: Miami : American Welding Society, c1978Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Lending 671.52. Place hold Add to cart (remove)
		Modern solder technology for competitive electronics manufacturing / Jennie S. Hwang. by Hwang, Jennie S. Material type: Book; Format: print Publisher: New York : McGraw-Hill, 1996Availability: Items available for loan: MTU Bishopstown Library (2). Location(s): Lending 621.381046. Place hold Add to cart (remove)
		Soldering / C.J. Thwaites, B.T.K. Barry. by Thwaites, C. J. (Colin John), 1927- \| Barry, B. T. K. (Thomas Kingcome), 1927- \| Design Council \| British Standards Institution \| Council of Engineering Institutions. Material type: Book Publisher: [London] : Oxford University Press for the Design Council, the British Standards Institution, and the Council of Engineering Institutions, 1975Availability: Items available for loan: MTU Bishopstown Library (2). Location(s): Store Item 671.56. Place hold Add to cart (remove)
		Metallurgy of welding / J. F. Lancaster. by Lancaster, J. F. (John Frederick). Edition: 6th ed.Material type: Book; Format: print Publisher: Cambridge : Abington, 1999Availability: Items available for loan: MTU Bishopstown Library (2). Location(s): Store Item 671.52. Place hold Add to cart (remove)
		The handbook of machine soldering : SMT and TH / Ralph W. Woodgate. by Woodgate, Ralph W, 1922-. Edition: 3rd ed.Material type: Book; Format: print Publisher: New York ; Chichester : Wiley, 1996Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Lending 621.381046. Place hold Add to cart (remove)
		No cover image available An analysis of printed circuit boards during reflow soldering / Paul Barry. by Barry, Paul. Material type: Book; Format: print Publisher: Cork : RTC, 1997Dissertation note: Thesis (Ms Eng) - Regional Technical College, Cork, 1997. Availability: Items available for reference: MTU Bishopstown Library [Call number: THESES PRESS] (1). Location(s): Thesis THESES PRESS. Lists: Masters Theses. Add to cart (remove)
		Reflow soldering processes : SMT, BGA, CSP, and flip chip technologies / Ning-Cheng Lee. by Lee, Ning-Cheng. Material type: Book; Format: print ; Literary form: Not fiction Publisher: Boston, Mass. : Newnes, 2001Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Lending 621.381. Place hold Add to cart (remove)
		Soldering, brazing, welding and adhesives / edited by D.R. Andrews. by Andrews, D. R \| Institution of Production Engineers (Great Britain). Material type: Book Publisher: London : Institution of Production Engineers, 1978Availability: Items available for loan: MTU Bishopstown Library (2). Location(s): Store Item 671.52. Place hold Add to cart (remove)

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