An analysis of printed circuit boards during reflow soldering / Paul Barry.
By: Barry, Paul.
Material type: BookSeries: M.Eng - Mechanical engineering.Publisher: Cork : RTC, 1997Description: x, 233 ,[38] .p : col.ill ; 30 cm. + hbk.Subject(s): Electronic circuits | Solder and soldering | Electronic circuits -- Testing | Manufacturing processesDDC classification: THESES PRESS Dissertation note: Thesis (Ms Eng) - Regional Technical College, Cork, 1997.Item type | Current library | Call number | Copy number | Status | Date due | Barcode | Item holds |
---|---|---|---|---|---|---|---|
Reference | MTU Bishopstown Library Thesis | THESES PRESS (Browse shelf(Opens below)) | 1 | Reference | 00056660 |
Total holds: 0
Thesis (Ms Eng) - Regional Technical College, Cork, 1997.
Bibliography: p. 228-233.