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		Chip scale package (CSP) : design, materials, processes, reliability, and applications / John H. Lau and Shi-Wei Ricky Lee. by Lau, John H \| Lee, Shi-Wei Ricky. Material type: Book; Format: print Publisher: New York ; London : McGraw-Hill, c1999Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Lending 621.3815. Place hold Add to cart (remove)
		Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies / John H. Lau. by Lau, John H. Material type: Book; Format: print Publisher: New York ; London : McGraw-Hill, 2000Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Lending 621.3815. Place hold Add to cart (remove)

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