MTU Cork Library Catalogue

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Smart sensors / Paul W. Chapman.

By: Chapman, Paul W.
Material type: materialTypeLabelBookSeries: Independent learning module from the Instrument Society of America: Publisher: Research Triangle Park , NC : ISA, 1996Description: x,162 p. : ill ; 26 cm. + hbk.ISBN: 1556175752 (m) (hbk).Subject(s): Detectors | Smart materialsDDC classification: 681.2
Contents:
Unit 1: Introduction and Overview -- Unit 2: Sensors and Sensing: History and Definitions -- Unit 3: Sensor Technologies -- Unit 4: Sensor Manufacturing -- Unit 5: Smart Sensing "Adding Value" to the Sensing Circuit -- Unit 6: Control Partitioning: Should the "Smarts" be in the sensor or the system? -- Unit 7: Sensors + Artificial Intelligence: The "high end" of sensor partitioning -- Sensor packaging: Pulling it all together -- Unit 9: Bus-based sensing systems: Combining controls, communication and diagnostic capabilities -- Unit 10: Is there life after Silicon? (a.k.a.: The future of Sensors).
Holdings
Item type Current library Call number Copy number Status Date due Barcode Item holds
General Lending MTU Bishopstown Library Lending 681.2 (Browse shelf(Opens below)) 1 Available 00090483
General Lending MTU Bishopstown Library Lending 681.2 (Browse shelf(Opens below)) 1 Available 00074920
Total holds: 0

Enhanced descriptions from Syndetics:

This book offers a self-study course addressing all facets of the application of sensors. This book contains examples of applying various materials technologies to a broad spectrum of sensing and control problems in many different markets.

ISA knowledge cnetre.

Includes bibliographical references (pages 137-149) and index.

Unit 1: Introduction and Overview -- Unit 2: Sensors and Sensing: History and Definitions -- Unit 3: Sensor Technologies -- Unit 4: Sensor Manufacturing -- Unit 5: Smart Sensing "Adding Value" to the Sensing Circuit -- Unit 6: Control Partitioning: Should the "Smarts" be in the sensor or the system? -- Unit 7: Sensors + Artificial Intelligence: The "high end" of sensor partitioning -- Sensor packaging: Pulling it all together -- Unit 9: Bus-based sensing systems: Combining controls, communication and diagnostic capabilities -- Unit 10: Is there life after Silicon? (a.k.a.: The future of Sensors).

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