Tin and solder plating in the semiconductor industry : a technical guide / A.C. Tan.
By: Tan, A. C
.
Material type: 
BookPublisher: London : Chapman & Hall, 1992Description: xvi, 326 p. : ill ; 24 cm. + hbk.ISBN: 0412482401 .Subject(s): Semiconductors -- Design and construction | Electroplating | Lead-tin alloys | TinDDC classification: 621.38152 | Item type | Current library | Call number | Copy number | Status | Date due | Barcode | Item holds |
|---|---|---|---|---|---|---|---|
| General Lending | MTU Bishopstown Library Lending | 621.38152 (Browse shelf(Opens below)) | 1 | Available | 00069047 |
Enhanced descriptions from Syndetics:
The object of this book is to provide balanced coverage of the theory and practice of plating semiconductor devices. The principal concepts of plating are introduced and best practice discussed. The book is designed to help electroplaters achieve `zero-defect' plating by providing an understanding of the plating chemistry and the handling of the plated parts.
Includes bibliographical references and index.
Introduction -- Basic electroplating -- Surface preparation for plating -- Plating operation -- Plating process control -- Plating quality assurance -- Corrosion -- Properties of tin, lead and tin-lead alloy -- Tin plating -- Tin-lead alloy plating -- Plating quality problems -- Chemical analysis -- Choice of metal finishing -- Waste treatment -- Improvements and future trends.