Tin and solder plating in the semiconductor industry : (Record no. 5242)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 01345 am a22003017a 4500 |
| 001 - CONTROL NUMBER | |
| control field | ocm0412482401 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 980811 1992 000 eng |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 0412482401 |
| 029 ## - OTHER SYSTEM CONTROL NUMBER (OCLC) | |
| OCLC library identifier | T22671 |
| 040 ## - CATALOGING SOURCE | |
| Modifying agency | OCoLC |
| 082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER | |
| Classification number | 621.38152 |
| 100 1# - MAIN ENTRY--PERSONAL NAME | |
| Personal name | Tan, A. C. |
| 9 (RLIN) | 21786 |
| 245 10 - TITLE STATEMENT | |
| Title | Tin and solder plating in the semiconductor industry : |
| Remainder of title | a technical guide / |
| Statement of responsibility, etc. | A.C. Tan. |
| 260 ## - PUBLICATION, DISTRIBUTION, ETC. | |
| Place of publication, distribution, etc. | London : |
| Name of publisher, distributor, etc. | Chapman & Hall, |
| Date of publication, distribution, etc. | 1992. |
| 300 ## - PHYSICAL DESCRIPTION | |
| Extent | xvi, 326 p. : |
| Other physical details | ill ; |
| Dimensions | 24 cm. + |
| Accompanying material | hbk. |
| 504 ## - BIBLIOGRAPHY, ETC. NOTE | |
| Bibliography, etc. note | Includes bibliographical references and index. |
| 505 0# - FORMATTED CONTENTS NOTE | |
| Formatted contents note | Introduction -- Basic electroplating -- Surface preparation for plating -- Plating operation -- Plating process control -- Plating quality assurance -- Corrosion -- Properties of tin, lead and tin-lead alloy -- Tin plating -- Tin-lead alloy plating -- Plating quality problems -- Chemical analysis -- Choice of metal finishing -- Waste treatment -- Improvements and future trends. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Semiconductors |
| General subdivision | Design and construction. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Electroplating. |
| 9 (RLIN) | 36764 |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Lead-tin alloys. |
| 9 (RLIN) | 39137 |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Tin. |
| 9 (RLIN) | 43366 |
| 907 ## - LOCAL DATA ELEMENT G, LDG (RLIN) | |
| a | .b10076566 |
| b | 140508 |
| c | 011116 |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Suppress in OPAC | 0 |
| 969 00 - LOCAL CODES | |
| a | 45439 |
| 979 00 - LOCAL CODES | |
| a | M'OC |
| b | 11 AUG 1998 |
| 989 00 - LOCAL CODES | |
| a | M'OC |
| b | 28 OCT 1998 |
| 998 ## - LOCAL CONTROL INFORMATION (RLIN) | |
| a | c |
| Operator's initials, OID (RLIN) | 011115 |
| Cataloger's initials, CIN (RLIN) | m |
| First Date, FD (RLIN) | a |
| Local | - |
| -- | eng |
| -- | enk |
| h | 0 |
| Withdrawn status | Lost status | Source of classification or shelving scheme | Damaged status | Not for loan | Home library | Current library | Shelving location | Date acquired | Cost, normal purchase price | Total Checkouts | Total Renewals | Full call number | Barcode | Date last seen | Copy number | Cost, replacement price | Price effective from | Koha item type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Dewey Decimal Classification | Available for Loan | MTU Bishopstown Library | MTU Bishopstown Library | Lending | 16/11/2001 | 152.52 | 1 | 621.38152 | 00069047 | 20/11/2017 | 1 | 152.52 | 20/11/2017 | General Lending |