MTU Cork Library Catalogue

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Surface mount technology with fine pitch components : the manufacturing issues / Hans Danielson.

By: Danielsson, Hans.
Material type: materialTypeLabelBookPublisher: London : Chapman & Hall, 1995Description: x, 242 p. : ill. ; 24 cm.ISBN: 0412553406 .Subject(s): Integrated circuits -- Design and construction | Surface mount technology | Fine pitch technologyDDC classification: 621.381531
Contents:
Introduction -- Economic aspects of manufacturing -- Driving forces in electronics -- Basic properties of solder materials -- Printing of solder pastes for fine pitch components -- The printing process -- The soldering process -- Parameters influencing soldering results -- Optimization of soldering results -- Design-related manufacturing problems -- Manufacturing problems specific to fine pitch components -- Soldering process influence on component reliability -- Limitations of current surface mount technology and new package types -- Future manufacturing technologies.
Holdings
Item type Current library Call number Copy number Status Date due Barcode Item holds
General Lending MTU Bishopstown Library Lending 621.381531 (Browse shelf(Opens below)) 1 Available 00015933
Total holds: 0

Enhanced descriptions from Syndetics:

This is a state-of-the-art guide to SMT with fine pitch components intended for professionals in electronics manufacturing. The overriding objective is to equip manufacturing people in the electronics industry with a better understanding of the manufacturing processes involved.

Includes bibliographical references and index.

Introduction -- Economic aspects of manufacturing -- Driving forces in electronics -- Basic properties of solder materials -- Printing of solder pastes for fine pitch components -- The printing process -- The soldering process -- Parameters influencing soldering results -- Optimization of soldering results -- Design-related manufacturing problems -- Manufacturing problems specific to fine pitch components -- Soldering process influence on component reliability -- Limitations of current surface mount technology and new package types -- Future manufacturing technologies.

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