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MARC view
Fine pitch technology (Topical Term)
Used for/see from:
- FPT (Printed circuits)
See also:
- Broader heading: Electronic packaging
- Broader heading: Solder and soldering
Work cat.: 93-25289: Handbook of fine pitch surface mount technology, 1993.
Engr. index: v. 89, pt. 2, p. 4121, under electronic packaging, surface mount technology (FPT soldering; fine pitch technology)
ASTI: under surface mount technology (fine pitch technology)
LC data base, 5/27/93 (Fine pitch technology; fine pitch equipment)
Marcoux, P.P. Fine pitch surface mount technology, c1992: pref. (term defined by standards organizations in 1987) p. 4 (describes the printed circuit board assembly technology for a family of integrated circuits packages distinguished by the fine spacing between their small leads. Fine pitch packages are defined as those with lead spacings of .65mm or less)
Ency. of electronics, 1990; Web. 3