MARC details
| 000 -LEADER |
|---|
| fixed length control field |
01234nam a2200253 a 4500 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION |
|---|
| fixed length control field |
2007 |
| 082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER |
|---|
| Classification number |
THESES PRESS |
| 100 1# - MAIN ENTRY--PERSONAL NAME |
|---|
| Personal name |
Cremin, Sean. |
| 245 10 - TITLE STATEMENT |
|---|
| Title |
Thermo-mechanical design of a 100 GHz MMIC power amplifier using flip chip technology / |
| Statement of responsibility, etc. |
Sean Cremin. |
| 260 ## - PUBLICATION, DISTRIBUTION, ETC. |
|---|
| Place of publication, distribution, etc. |
Cork : |
| Name of publisher, distributor, etc. |
Cork Institute of Technology, |
| Date of publication, distribution, etc. |
2007. |
| 300 ## - PHYSICAL DESCRIPTION |
|---|
| Extent |
152 p. : |
| Other physical details |
col. ill. ; |
| Dimensions |
30 cm. + |
| Accompanying material |
hbk. |
| 490 #0 - SERIES STATEMENT |
|---|
| Series statement |
M.Eng - Mechanical Engineering |
| 502 ## - DISSERTATION NOTE |
|---|
| Dissertation note |
Thesis (M.Eng) - Cork Institute of Technology, 2007. |
| 504 ## - BIBLIOGRAPHY, ETC. NOTE |
|---|
| Bibliography, etc. note |
Bibliographical references p. 123-129. |
| 505 0# - FORMATTED CONTENTS NOTE |
|---|
| Formatted contents note |
Introduction & motivation -- Literature review -- Thermo-mechanical design of flip chip MMIC power amplifier -- Thermal modelling of flip chip MMIC, bump bond and substrate -- Thermal characterisation of 100 GHz flip chip MPA -- Inspection of bump bonding and MMIC -- Results and conclusions. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name entry element |
Power amplifiers. |
| 9 (RLIN) |
41376 |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name entry element |
Semiconductors. |
| 9 (RLIN) |
42310 |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name entry element |
Multichip modules (Microelectronics). |
| 9 (RLIN) |
45261 |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name entry element |
Microelectronic packaging. |
| 9 (RLIN) |
39931 |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name entry element |
Manufacturing processes |
| 9 (RLIN) |
39501 |
| 907 ## - LOCAL DATA ELEMENT G, LDG (RLIN) |
|---|
| a |
.b1084482x |
| b |
150326 |
| c |
071030 |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) |
|---|
| Suppress in OPAC |
0 |
| 998 ## - LOCAL CONTROL INFORMATION (RLIN) |
|---|
| a |
c |
| Operator's initials, OID (RLIN) |
071030 |
| Cataloger's initials, CIN (RLIN) |
m |
| First Date, FD (RLIN) |
a |
| Local |
- |
| -- |
eng |
| -- |
ie |
| h |
0 |