Thermo-mechanical design of a 100 GHz MMIC power amplifier using flip chip technology / Sean Cremin.
By: Cremin, Sean.
Material type: BookSeries: M.Eng - Mechanical Engineering.Publisher: Cork : Cork Institute of Technology, 2007Description: 152 p. : col. ill. ; 30 cm. + hbk.Subject(s): Power amplifiers | Semiconductors | Multichip modules (Microelectronics) | Microelectronic packaging | Manufacturing processesDDC classification: THESES PRESSItem type | Current library | Call number | Copy number | Status | Date due | Barcode | Item holds |
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Reference | MTU Bishopstown Library Thesis | THESES PRESS (Browse shelf(Opens below)) | 1 | Reference | 00151213 |
Thesis (M.Eng) - Cork Institute of Technology, 2007.
Bibliographical references p. 123-129.
Introduction & motivation -- Literature review -- Thermo-mechanical design of flip chip MMIC power amplifier -- Thermal modelling of flip chip MMIC, bump bond and substrate -- Thermal characterisation of 100 GHz flip chip MPA -- Inspection of bump bonding and MMIC -- Results and conclusions.