MTU Cork Library Catalogue

Thermo-mechanical design of a 100 GHz MMIC power amplifier using flip chip technology / Sean Cremin.

By: Cremin, Sean.
Material type: materialTypeLabelBookSeries: M.Eng - Mechanical Engineering.Publisher: Cork : Cork Institute of Technology, 2007Description: 152 p. : col. ill. ; 30 cm. + hbk.Subject(s): Power amplifiers | Semiconductors | Multichip modules (Microelectronics) | Microelectronic packaging | Manufacturing processesDDC classification: THESES PRESS
Contents:
Introduction & motivation -- Literature review -- Thermo-mechanical design of flip chip MMIC power amplifier -- Thermal modelling of flip chip MMIC, bump bond and substrate -- Thermal characterisation of 100 GHz flip chip MPA -- Inspection of bump bonding and MMIC -- Results and conclusions.
Dissertation note: Thesis (M.Eng) - Cork Institute of Technology, 2007.
List(s) this item appears in: Masters Theses | Published by CIT
Holdings
Item type Current library Call number Copy number Status Date due Barcode Item holds
Reference MTU Bishopstown Library Thesis THESES PRESS (Browse shelf(Opens below)) 1 Reference 00151213
Total holds: 0

Thesis (M.Eng) - Cork Institute of Technology, 2007.

Bibliographical references p. 123-129.

Introduction & motivation -- Literature review -- Thermo-mechanical design of flip chip MMIC power amplifier -- Thermal modelling of flip chip MMIC, bump bond and substrate -- Thermal characterisation of 100 GHz flip chip MPA -- Inspection of bump bonding and MMIC -- Results and conclusions.

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