| 000 | 00959 am a2200289 a 4500 | ||
|---|---|---|---|
| 001 | ocm00036394 | ||
| 008 | 970617 1997 000 eng | ||
| 040 | _dOCoLC | ||
| 082 | 0 | 4 | _aTHESES PRESS |
| 100 | 1 |
_aBarry, Paul. _927584 |
|
| 245 | 1 | 3 |
_aAn analysis of printed circuit boards during reflow soldering / _cPaul Barry. |
| 260 |
_aCork : _bRTC, _c1997. |
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| 300 |
_ax, 233 ,[38] .p : _bcol.ill ; _c30 cm. + _ehbk. |
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| 490 | 0 | _aM.Eng - Mechanical engineering | |
| 502 | _aThesis (Ms Eng) - Regional Technical College, Cork, 1997. | ||
| 504 | _aBibliography: p. 228-233. | ||
| 650 | 0 |
_aElectronic circuits. _936712 |
|
| 650 | 0 |
_aSolder and soldering. _942696 |
|
| 650 | 0 |
_aElectronic circuits _xTesting. _936713 |
|
| 650 | 0 |
_aManufacturing processes _939501 |
|
| 907 |
_a.b10309731 _b120402 _c011116 |
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| 942 | _n0 | ||
| 969 | 0 | 0 | _a36394 |
| 979 | 0 | 0 |
_aFQ _b17 JUN 1997 |
| 989 | 0 | 0 |
_aFQ _b16 NOV 1998 |
| 998 |
_ac _b011115 _cm _da _e- _feng _gie _h3 |
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| 999 |
_c23712 _d23712 |
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