Your search returned 8 results.

Results
		Modern solder technology for competitive electronics manufacturing / Jennie S. Hwang. by Hwang, Jennie S. Material type: Book; Format: print Publisher: New York : McGraw-Hill, 1996Availability: Items available for loan: MTU Bishopstown Library (2). Location(s): Lending 621.381046. Place hold Add to cart (remove)
		Semiconductor packaging : a multidisciplinary approach / edited by Robert J. Hannermann, Allan D. Kraus and Michael Pecht. by Hannermann, Robert J \| Kraus, Allan D \| Pecht, Michael. Material type: Book; Format: print Publisher: London ; New York : Wiley-Interscience, 1997Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Lending 621.381046. Place hold Add to cart (remove)
		The Electronics assembly handbook / edited by Frank Riley and the staff of Electronic packaging and production. by Riley, Frank J. Material type: Book Publisher: Bedford, U.K. : Berlin ; New York : IFS Publications ; Springer-Verlag, 1988Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Lending 621.3815. Place hold Add to cart (remove)
		Newnes electronics assembly pocket book / Keith Brindley. by Brindley, Keith. Material type: Book Publisher: Oxford : BH Newnes, 1991Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Lending 621.3815. Place hold Add to cart (remove)
		Electronic packaging : design, materials, process, and reliability / John H. Lau ... [et al.]. by Lau, John H \| Prince, John L, 1941- \| Nakayama, Wataru. Material type: Book; Format: print Publisher: New York ; London : McGraw-Hill, 1998Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Lending 621.381046. Place hold Add to cart (remove)
		The handbook of machine soldering : SMT and TH / Ralph W. Woodgate. by Woodgate, Ralph W, 1922-. Edition: 3rd ed.Material type: Book; Format: print Publisher: New York ; Chichester : Wiley, 1996Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Lending 621.381046. Place hold Add to cart (remove)
		Newnes electronics assembly handbook / Keith Brindley. by Brindley, Keith. Material type: Book; Format: print Publisher: Oxford : Newnes, 1993Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Lending 621.3815. Place hold Add to cart (remove)
		Reflow soldering processes : SMT, BGA, CSP, and flip chip technologies / Ning-Cheng Lee. by Lee, Ning-Cheng. Material type: Book; Format: print ; Literary form: Not fiction Publisher: Boston, Mass. : Newnes, 2001Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Lending 621.381. Place hold Add to cart (remove)

Powered by Koha