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		Modern solder technology for competitive electronics manufacturing / Jennie S. Hwang. by Hwang, Jennie S. Material type: Book; Format: print Publisher: New York : McGraw-Hill, 1996Availability: Items available for loan: MTU Bishopstown Library (2). Location(s): Lending 621.381046. Place hold Add to cart (remove)
		Electronic packaging and interconnection handbook / edited by Charles A. Harper. by Harper, Charles A. Edition: 2nd ed.Material type: Book; Format: print Publisher: New York : McGraw-Hill, 1997Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Lending 621.381046. Place hold Add to cart (remove)
		Electronic packaging : design, materials, process, and reliability / John H. Lau ... [et al.]. by Lau, John H \| Prince, John L, 1941- \| Nakayama, Wataru. Material type: Book; Format: print Publisher: New York ; London : McGraw-Hill, 1998Availability: Items available for loan: MTU Bishopstown Library (1). Location(s): Lending 621.381046. Place hold Add to cart (remove)

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