Image from Syndetics
Electronic packaging : design, materials, process, and reliability / John H. Lau ... [et al.].
By: Lau, John H
.
Contributor(s): Prince, John L | Nakayama, Wataru.
Material type: 
BookSeries: Electronic packaging and interconnection series.Publisher: New York ; London : McGraw-Hill, 1998Description: xxiv, 498 p. : ill. ; 24 cm.ISBN: 0070371350.Subject(s): Electronic packagingDDC classification: 621.381046
| Item type | Current library | Call number | Copy number | Status | Date due | Barcode | Item holds |
|---|---|---|---|---|---|---|---|
| General Lending | MTU Bishopstown Library Lending | 621.381046 (Browse shelf(Opens below)) | 1 | Available | 00078113 |
Total holds: 0
Enhanced descriptions from Syndetics:
Intended to be an electronic packaging resource, this text features writing from four leaders in the the four intertwined disciplines of packaging. Recent technological advances are discussed, including BGA, Flip Chip and CSP.
Includes bibliographical references and index.
Table of contents provided by Syndetics
- Introduction
- Basic Electrical Effects in Electronic Packagingand Interconnects
- Thermal Design, Analysis, and Measurementof Electronic Packaging
- Mechanical Design, Analysis, Measurement,and Reliability of Electronic Packaging
- Polymers forElectronic Packaging: Materials, Processes, and Reliability
- Index