MTU Cork Library Catalogue

Syndetics cover image
Image from Syndetics

Semiconductor packaging : a multidisciplinary approach / edited by Robert J. Hannermann, Allan D. Kraus and Michael Pecht.

Contributor(s): Hannermann, Robert J | Kraus, Allan D | Pecht, Michael.
Material type: materialTypeLabelBookPublisher: London ; New York : Wiley-Interscience, 1997Description: x, 887 p. ; 23 cm. + pbk.ISBN: 0471181234 ; 0471532991 .Subject(s): Electronic packaging | Integrated circuits -- Very large scale integrationDDC classification: 621.381046
Contents:
Introduction / Robert J. Hanneman -- Semiconductor packaging / Kenneth M. Brown -- Interconnect substrate technologies / Iwona Turlik -- Electronic module technology / Peter Sandborn and Dennis Herrell -- Interassembly and intersystem interconnect / Robert S. Mroczkowski -- Manufacturing multichip modules / Rakesh K. Agarwal and Michael Pecht -- Electronic system topology and design / Douglas C. Schmidt -- Electrical design of packaging systems / Raj Mittra and Colin Gordon -- Thermal design and control / Avram Bar-Cohen -- Vibration and shock analysis / Fred Barez -- Mechanical design methodologies in electronic packaging / Ephraim Suhir -- Electronic packaging materials and their properties / Michael Pecht and Rakesh K. Agarwal -- Reliability issues / Michael Pecht.
Holdings
Item type Current library Call number Copy number Status Date due Barcode Item holds
General Lending MTU Bishopstown Library Lending 621.381046 (Browse shelf(Opens below)) 1 Available 00082320
Total holds: 0

Enhanced descriptions from Syndetics:

This practical guide covers the full spectrum of issues and problems that confront the packaging engineer and provides all the tools and information needed to overcome them.

In this book, practicing mechanical, electrical, and materials engineers, academic researchers, and graduate students will find all the essentials required to master the packaging and interconnection of microelectronic components. Providing thorough coverage of the interdisciplinary and interfunctional issues that come with the territory, the authors...

Cover all physical systems, processes, and materials from chip edge through intersystem interconnect, including thermal control, soldering processes, selection of package materials, and much more Emphasize the interaction of electrical, mechanical, materials, and reliability engineering in the design of modern electronic products, particularly computers and consumer electronics Focus on the underlying principles and technologies that will remain the basis for electronic design and manufacture through the next decade.

The first book to offer systematic treatment of the engineering science and applications art involved in the creation of microelectronic devices, Semiconductor Packaging is essential reading for anyone interested in creating successful and reliable electronic products, both now and for years to come.

Includes bibliographical references and indexes.

Introduction / Robert J. Hanneman -- Semiconductor packaging / Kenneth M. Brown -- Interconnect substrate technologies / Iwona Turlik -- Electronic module technology / Peter Sandborn and Dennis Herrell -- Interassembly and intersystem interconnect / Robert S. Mroczkowski -- Manufacturing multichip modules / Rakesh K. Agarwal and Michael Pecht -- Electronic system topology and design / Douglas C. Schmidt -- Electrical design of packaging systems / Raj Mittra and Colin Gordon -- Thermal design and control / Avram Bar-Cohen -- Vibration and shock analysis / Fred Barez -- Mechanical design methodologies in electronic packaging / Ephraim Suhir -- Electronic packaging materials and their properties / Michael Pecht and Rakesh K. Agarwal -- Reliability issues / Michael Pecht.

Table of contents provided by Syndetics

  • Semiconductor Packaging
  • Interconnect Substrate Technologies
  • Electronic Module Technology
  • Interassembly and Intersystem Interconnect
  • Manufacturing Multichip Modules
  • Electronic System Topology and Design
  • Electrical Design of Packaging Systems
  • Thermal Design and Control
  • Vibration and Shock Analysis
  • Mechanical Design Methodologies in Electronic Packaging
  • Electronic Packaging Materials and Their Properties
  • Reliability Issues
  • Indexes

Author notes provided by Syndetics

ROBERT J. HANNEMANN, a Digital Corporate Consultant Engineer, is Director of Digital's Mobile Systems Program.

ALLAN D. KRAUS is Professor of Electrical Engineering at the Naval Postgraduate School in Monterey, California.

MICHAEL PECHT is Director of the CALCE Center for Electronic Packaging and Professor at the University of Maryland.

Powered by Koha