MTU Cork Library Catalogue

Syndetics cover image
Image from Syndetics

Area array packaging handbook / Ken Gilleo.

By: Gilleo, Ken.
Material type: materialTypeLabelBookSeries: McGraw-Hill packaging and electronics books; McGraw-Hill handbooks.Publisher: New York : McGraw-Hill, 2002Description: 1 v. (various pagings) : ill. ; 25 cm. + hbk.ISBN: 0071374930 (alk. paper).Subject(s): Ball grid array technology | Microelectronic packagingDDC classification: 621.381046
Holdings
Item type Current library Call number Copy number Status Date due Barcode Item holds
General Lending MTU Bishopstown Library Lending 621.381046 (Browse shelf(Opens below)) 1 Available 00092154
Total holds: 0

Enhanced descriptions from Syndetics:

Area array packaging, comprising the use of ball grid array (BGA), chip scale package (CSP) and flip chip (FC) technologies, is the fastest growing segment of the electronics packaging and manufacturing market. It is being driven by the increased need for high density interconnects (HDI) for portable communications devices like laptops, cell phones, palm tops and micro-browsers. Packaging is the bottleneck in creating these micro-devices, and area array packaging, creating packages 20 times smaller than those of traditional packaging, is the solution.

Includes bibliographical references and index.

Table of contents provided by Syndetics

  • Forword
  • Section 1 Packaging Concepts and Design
  • Chapter 1 Introduction to Electronic Packaging
  • Chapter 2 Electronics Industry Overview
  • Chapter 3 Trends/Drivers in the Electronics Manufacturing Industry
  • Chapter 4 Area Array Packaging
  • Chapter 5 Stacked/3D Packages
  • Chapter 6 Compliant IC Packaging
  • Chapter 7 Flip Chip Technology
  • Chapter 8 Options in High-Density Part Cleaning
  • Chapter 9 MEMS Packaging and Assembly Challenges
  • Chapter 10 Ceramic Ball and Column Grid Array Overview
  • Section 2 Materials
  • Chapter 11 Polyer Packaging Materials: Adhesives, Encapsulants, and Underfills
  • Chapter 12 Hermetic Packaging Systems: Adhesive and Getter
  • Chapter 13 Area Array Solder Spheres, Pastes, and Fluxes
  • Chapter 14 Modern Solder and Solder Paste
  • Chapter 15 Lead-Free Systems and Process Implications
  • Chapter 16 Electrically Conductive Adhesives for Surface-Mount and Flip Chip Processes: An Alternative to Solder?
  • Section 3 Equipment and Processes
  • Chapter 17 Next-Generation Flip Chip Materials and Processes
  • Chapter 18 Flip Chip Assembly and Underfilling
  • Chapter 19 BGA and CSP Rework: What is Involved?
  • Chapter 20 BGA Assembly Reliability
  • Chapter 21 Die Attach and Rework
  • Chapter 22 Liquid Encapsulation Equipment and Processes
  • Chapter 23 Molding for Area Array Packages
  • Chapter 24 Screen Printing and Stenciling
  • Chapter 25 Criteria for Placement and Processing of Advanced Packages
  • Chapter 26 Ovens in Electronics
  • Chapter 27 Process Development, Control, and Organization
  • Section 4 Economics and Productivity
  • Chapter 28 Metrics: The Key to Productivity
  • Chapter 29 Cost Estimating for Electronic Assembly
  • Section 5 Future
  • Chapter 30 The Future of Electronic Packaging
  • Chapter 31 The Future of SMT Process Equipment
  • Index

Powered by Koha