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Chip scale package (CSP) : design, materials, processes, reliability, and applications / John H. Lau and Shi-Wei Ricky Lee.

By: Lau, John H.
Contributor(s): Lee, Shi-Wei Ricky.
Material type: materialTypeLabelBookSeries: Electronic packaging and interconnection series.Publisher: New York ; London : McGraw-Hill, c1999Description: xxii, 564 p. : ill. ; 24 cm. + hbk.ISBN: 0070383049.Subject(s): Integrated circuits -- Design and construction | Microelectronic packagingDDC classification: 621.3815
Contents:
Part 1: Flip chip and wire bond for CSP -- Solder-bumped flip chip and wire-bonding chip on CSP substrate -- Part 2: Customized leadframe based CSPs -- Fujitsu's small outline no-lead/C-lead package (SON/SOC) -- Fujitsu's bump chip carrier (BCC) -- Fujitsu's microBGA and Quad flat nonleaded package (QFN) -- Hitachi cable's lead-on-chip chip scale package (LOC-CSP) -- Hitachi cable's micro stud array package (MSA) -- LG Semicon's bottom-leaded plastic package (BLP) -- TI Japan's memory chip scale package with LOC (MCSP) -- Part 3: CSPs with flexible substrate -- 3M's enhanced flex CSP -- General electric's chip-on-flex chip scale package (COF-CSP) -- Hitachi's chip scale package for memory devices -- IZM's flexPAC -- NEC's fine-pitch ball grid array (FPBGA) -- Nitto Denko's molded chip size package (MCSP) -- Sharp's chip scale package -- Tessera's micro-ball grid array (uBGA) -- TI Japan's micro-star BGA (uStar BGA) -- TI Japan's memory chip scale package with flexible substrate (MCSP) -- Part 4: CSPs with rigid substrate -- Amkor/Anam's chiparray package -- EPS's low-cost solder-bumped flip chip NuCSP -- IBM's ceramic mini-ball grid array package (mini-BGA) -- IBM's flip chip-plastic ball grid array package (FC/PBGA) -- Matsushita's MN-PAC -- Motorola's SLICC and JACS-Pak -- National semiconductor's plastic chip carrier (PCC) -- NEC's three-dimensional memory module (3DM) and CSP -- Sony's transformed grid array package (TGA) -- Toshiba's ceramic/plastic fine-pitch BGA package (C/P-FBGA) -- Part 5: Wafer-level redistribution CSPs -- Chipscale's micro SMT package (MSMT) -- EPIC's chip scale package -- Flip chip technologies' UltraCSP -- Fujitsu's super CSP (SCSP) -- Mitsubishi's chip scale package (CSP) -- National semiconductor's uSMD -- Sandia National Laboratories' mini ball grid array package (mBGA) -- Shellcase's shell-PACK/Shell-BGA.
Holdings
Item type Current library Call number Copy number Status Date due Barcode Item holds
General Lending MTU Bishopstown Library Lending 621.3815 (Browse shelf(Opens below)) 1 Available 00078077
Total holds: 0

Enhanced descriptions from Syndetics:

This text details current trends in CSP (Chip Scale Packaging) design and developments, covering each major type, chip scale and package developed by each major vendor, detailing the efficiency and cost effectiveness of different packages in varying applications.

Includes bibliographical references and index.

Part 1: Flip chip and wire bond for CSP -- Solder-bumped flip chip and wire-bonding chip on CSP substrate -- Part 2: Customized leadframe based CSPs -- Fujitsu's small outline no-lead/C-lead package (SON/SOC) -- Fujitsu's bump chip carrier (BCC) -- Fujitsu's microBGA and Quad flat nonleaded package (QFN) -- Hitachi cable's lead-on-chip chip scale package (LOC-CSP) -- Hitachi cable's micro stud array package (MSA) -- LG Semicon's bottom-leaded plastic package (BLP) -- TI Japan's memory chip scale package with LOC (MCSP) -- Part 3: CSPs with flexible substrate -- 3M's enhanced flex CSP -- General electric's chip-on-flex chip scale package (COF-CSP) -- Hitachi's chip scale package for memory devices -- IZM's flexPAC -- NEC's fine-pitch ball grid array (FPBGA) -- Nitto Denko's molded chip size package (MCSP) -- Sharp's chip scale package -- Tessera's micro-ball grid array (uBGA) -- TI Japan's micro-star BGA (uStar BGA) -- TI Japan's memory chip scale package with flexible substrate (MCSP) -- Part 4: CSPs with rigid substrate -- Amkor/Anam's chiparray package -- EPS's low-cost solder-bumped flip chip NuCSP -- IBM's ceramic mini-ball grid array package (mini-BGA) -- IBM's flip chip-plastic ball grid array package (FC/PBGA) -- Matsushita's MN-PAC -- Motorola's SLICC and JACS-Pak -- National semiconductor's plastic chip carrier (PCC) -- NEC's three-dimensional memory module (3DM) and CSP -- Sony's transformed grid array package (TGA) -- Toshiba's ceramic/plastic fine-pitch BGA package (C/P-FBGA) -- Part 5: Wafer-level redistribution CSPs -- Chipscale's micro SMT package (MSMT) -- EPIC's chip scale package -- Flip chip technologies' UltraCSP -- Fujitsu's super CSP (SCSP) -- Mitsubishi's chip scale package (CSP) -- National semiconductor's uSMD -- Sandia National Laboratories' mini ball grid array package (mBGA) -- Shellcase's shell-PACK/Shell-BGA.

Table of contents provided by Syndetics

  • Part I Flip Chip and Wire Bond for CSP
  • Solder-Bumped Flip Chip and Wire-Bonding Chip on CSP Substrate
  • Part II Customized Leadframe Based CSPs
  • Fujitsu's Small Outline No-Lead/C-Lead Package (SON/SOC)
  • Fujitsu's Bump Chip Carrier (BCC)
  • Fujitsu's MicroBGA and Quad Flat Nonleaded Package (QFN)
  • Hitachi Cable's Lead-on-Chip Chip Scale Package (LOC-CSP)
  • Hitachi Cable's Micro Stud Array Package (MSA)
  • LG Semicon's Bottom-Leaded Plastic Package (BLP)
  • TI Japan's Memory Chip Scale Package with LOC (MCSP)
  • Part III CSPs with Flexible Substrate
  • 3M's Enhanced Flex CSP
  • General Electric's Chip-on-Flex Chip Scale Package (COF-CSP)
  • Hitachi's Chip Scale Package for Memory Devices
  • IZM's flexPAC
  • NEC's Fine-Pitch Ball Grid Array (FPBGA)
  • Nitto Denko's Molded Chip Size Package (MCSP)
  • Sharp's Chip Scale Package
  • Tessera's Micro-Ball Grid Array
  • TI Japan's Micro-Star BGA
  • TI Japan's Memory Chip Scale Package with Flexible Substrate (MCSP)
  • Part IV CSPs with Rigid Substrate
  • Amkor/Anam's ChipArray Package
  • EPS's Low-Cost Solder-Bumped Flip Chip NuCSP
  • IBM's Ceramic Mini-Ball Grid Array Package (Mini-BGA)
  • IBM's Flip Chip-Plastic Ball Grid Array Package (FC/PBGA)
  • Matsuhita's MN-PAC
  • Motorola's SLICC and JACS-Pak
  • National Semiconductor's Plastic Chip Carrier (PCC)
  • NEC's Three-Dimensional Memory Module (3DM) and CSP
  • Sony's Transformed Grid Array Package (TGA)
  • Toshiba's Ceramic/Plastic Fine-Pitch BGA Package (C/P-FBGA)
  • Part V Wafer-Level Redistribution CSPs
  • ChipScale's Micro SMT Package (MSMT)
  • EPIC's Chip Scale Package
  • Flip Chip Technologies' UltraCSP
  • Fujitsu's Super CSP (SCSP)
  • Mitsubishi's Chip Scale Package (CSP)
  • National Semiconductor's SMD
  • Sandia National Laboratories' Mini Ball Grid Array Package (mBGA)
  • ShellCase's Shell-PACK/Shell-BGA

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