Cremin, Sean. <br/><br/>
Thermo-mechanical design of a 100 GHz MMIC power amplifier using flip chip technology / 
Sean Cremin. 
 - Cork :  Cork Institute of Technology,  2007. 
 - 152 p. :  col. ill. ;  30 cm. +  hbk. 
 - M.Eng - Mechanical Engineering .
<br/><br/>Thesis (M.Eng) - Cork Institute of Technology, 2007. 
<br/><br/>Bibliographical references p. 123-129. 
<br/><br/>Introduction & motivation -- Literature review -- Thermo-mechanical design of flip chip MMIC power amplifier -- Thermal modelling of flip chip MMIC, bump bond and substrate --  Thermal characterisation of 100 GHz flip chip MPA -- Inspection of bump bonding and MMIC -- Results and conclusions. 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Power amplifiers. <br/>Semiconductors.<br/>Multichip modules (Microelectronics). <br/>Microelectronic packaging. <br/>Manufacturing processes
<br/><br/><label>Dewey Class. No.: </label>THESES PRESS