Semiconductor packaging :  a multidisciplinary approach / 
edited by Robert J. Hannermann, Allan D. Kraus and Michael Pecht. 
 - London ;  New York :  Wiley-Interscience,  1997. 
 - x, 887 p. ;  23 cm. +  pbk. 
<br/><br/>Includes bibliographical references and indexes. 
<br/><br/>Introduction / Robert J. Hanneman -- Semiconductor packaging / Kenneth M. Brown -- Interconnect substrate technologies / Iwona Turlik -- Electronic module technology / Peter Sandborn and Dennis Herrell -- Interassembly and intersystem interconnect / Robert S. Mroczkowski -- Manufacturing multichip modules / Rakesh K. Agarwal and Michael Pecht -- Electronic system topology and design / Douglas C. Schmidt -- Electrical design of packaging systems / Raj Mittra and Colin Gordon -- Thermal design and control / Avram Bar-Cohen -- Vibration and shock analysis / Fred Barez -- Mechanical design methodologies in electronic packaging / Ephraim Suhir -- Electronic packaging materials and their properties / Michael Pecht and Rakesh K. Agarwal -- Reliability issues / Michael Pecht. 
<br/><br/><label>ISBN: </label>0471181234  0471532991  
<br/><br/><label>Subjects--Topical Terms: </label><br/>Electronic packaging.<br/>Integrated circuits--Very large scale integration.
<br/><br/><label>Dewey Class. No.: </label>621.381046