Materials for electronic packaging / 
edited by Deborah D.L. Chung. 
 - Boston :  Butterworth-Heinemann,  1995. 
 - xiv, 368 p. :  ill. ;  24 cm. +  hbk. 
<br/><br/>Includes bibliographical references and index. 
<br/><br/>Part I:  Overview -- Overview of materials for electronic packaging / D. D. L. Chung -- Part II:  Joining -- Solderability fundamentals:  microscopic processes / J. A. Clum, T. J. Singler -- Determining the damaging strains which cause failure in Pb-Sn solders / A. I. Attarwala, B. C. Hendrix, J. M. Sanchez -- Fluxless soldering for microelectronic applications / D. R. Frear, F. M. Hosking, D. M. Keicher, H. C. Peebles -- The effect of microstructure on fracture of metal/ceramic interfaces / Ivar E. Reimanis -- Part III:  Composites -- The future of advanced composite electronic packaging / Carl Zweben -- Low thermal expansion composite materials for electronic packaging / D. D. L. Chung -- Conducting polymer-matrix composites / D. D. L. Chung, Lin Li -- Part IV:  Metal films -- Thick film technology / Rene E. Cote -- Electroless copper for micropackaging and ultralarge-scale integrated circuit applications / Y. Shacham-Diamand -- Vacuum metallization for integrated circuit packages / K. J. Blackwell, P. C. Chen, A. R. Knoll, J. J. Cuomo -- Part V:  Polymers and other materials -- Silicon-based polymers in electronic packaging / C. P. Wong -- Dielectric films for high temperature, high voltage power electronics / Javaid R. Laghari, Jayant L. Suthar -- Electrically conducting polymers and organic materials / M. J. Naughton -- Diamond in electronic packages / D. J. Pickrell, D. S. Hoover -- Part VI:  Materials testing -- Measurements of properties of materials in electronic packaging / Joseph A. Carpenter, Jr. 
<br/><br/><label>ISBN: </label>0750693142 
<br/><br/><label>LCCN: </label>94049204 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Electronic packaging--Materials.
<br/><br/><label>Dewey Class. No.: </label>621.381046