Hwang, Jennie S. <br/><br/>
Modern solder technology for competitive electronics manufacturing / 
Jennie S. Hwang. 
 - New York :  McGraw-Hill,  1996. 
 - xliv, 622 p. :  ill. ;  24 cm. +  hbk. 
 - Electronic packaging and interconnection series .
<br/><br/>Includes bibliographical references and index. 
<br/><br/><label>ISBN: </label>0070317496  
<br/><br/><label>LCCN: </label>95044641 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Electronic packaging.<br/>Solder and soldering.
<br/><br/><label>Dewey Class. No.: </label>621.381046