Chip scale package (CSP) : design, materials, processes, reliability, and applications /
John H. Lau and Shi-Wei Ricky Lee.
- New York ; London : McGraw-Hill, c1999.
- xxii, 564 p. : ill. ; 24 cm. + hbk.
- Electronic packaging and interconnection series .
Includes bibliographical references and index.
Part 1: Flip chip and wire bond for CSP -- Solder-bumped flip chip and wire-bonding chip on CSP substrate -- Part 2: Customized leadframe based CSPs -- Fujitsu's small outline no-lead/C-lead package (SON/SOC) -- Fujitsu's bump chip carrier (BCC) -- Fujitsu's microBGA and Quad flat nonleaded package (QFN) -- Hitachi cable's lead-on-chip chip scale package (LOC-CSP) -- Hitachi cable's micro stud array package (MSA) -- LG Semicon's bottom-leaded plastic package (BLP) -- TI Japan's memory chip scale package with LOC (MCSP) -- Part 3: CSPs with flexible substrate -- 3M's enhanced flex CSP -- General electric's chip-on-flex chip scale package (COF-CSP) -- Hitachi's chip scale package for memory devices -- IZM's flexPAC -- NEC's fine-pitch ball grid array (FPBGA) -- Nitto Denko's molded chip size package (MCSP) -- Sharp's chip scale package -- Tessera's micro-ball grid array (uBGA) -- TI Japan's micro-star BGA (uStar BGA) -- TI Japan's memory chip scale package with flexible substrate (MCSP) -- Part 4: CSPs with rigid substrate -- Amkor/Anam's chiparray package -- EPS's low-cost solder-bumped flip chip NuCSP -- IBM's ceramic mini-ball grid array package (mini-BGA) -- IBM's flip chip-plastic ball grid array package (FC/PBGA) -- Matsushita's MN-PAC -- Motorola's SLICC and JACS-Pak -- National semiconductor's plastic chip carrier (PCC) -- NEC's three-dimensional memory module (3DM) and CSP -- Sony's transformed grid array package (TGA) -- Toshiba's ceramic/plastic fine-pitch BGA package (C/P-FBGA) -- Part 5: Wafer-level redistribution CSPs -- Chipscale's micro SMT package (MSMT) -- EPIC's chip scale package -- Flip chip technologies' UltraCSP -- Fujitsu's super CSP (SCSP) -- Mitsubishi's chip scale package (CSP) -- National semiconductor's uSMD -- Sandia National Laboratories' mini ball grid array package (mBGA) -- Shellcase's shell-PACK/Shell-BGA.
0070383049
98053224
Integrated circuits--Design and construction. Microelectronic packaging.