Understanding smart sensors / Randy Frank.

By: Frank, Randy .

Material type: materialTypeLabel

BookPublisher: Boston : Artech House, 1996Description: xvi, 269 p. : ill. ; 24 cm.ISBN: 0890068240.Subject(s): Detectors -- Design and construction

| Programmable controllers

| Signal processing -- Digital techniques

| Semiconductors

| Application specific integrated circuits

DDC classification: 681.2

Contents:

Smart Sensor Basics -- Micromachining -- The nature of semiconductor sensor output -- Getting sensor information into the MCU -- Using MCUs/DSPs to increase Sensor IQ -- Communications for smart sensors -- Control techniques -- Transceivers, transponders and telemetry -- Microelectromechanical systems (MEMS) -- Packaging implications of smarter sensors -- Mechatronics and sensing systems -- The next phase of sensing systems.

Holdings
Item type	Current library	Call number	Copy number	Status	Date due	Barcode	Item holds
General Lending	MTU Bishopstown Library Lending	681.2 (Browse shelf(Opens below))	1	Available		00009869
General Lending	MTU Bishopstown Library Lending	681.2 (Browse shelf(Opens below))	1	Available		00070441

Total holds: 0

Enhanced descriptions from Syndetics:

"Two of the most important trends in sensor development in recent years have been advances in micromachined sensing elements of all kinds, and the increase in intelligence applied at the sensor level. This book addresses both, and provides a good overview of current technology". -- I&CS

Includes bibliographical references and index.

Table of contents provided by Syndetics

Preface (p. xv)
Chapter 1 Smart Sensor Basics (p. 1)
1.1 Introduction (p. 1)
1.2 Mechanical-Electronic Transitions in Sensing (p. 3)
1.3 Nature of Sensors (p. 4)
1.4 Integration of Micromachining and Microelectronics (p. 9)
1.5 Summary (p. 14)
References (p. 14)
Chapter 2 Micromachining (p. 15)
2.1 Introduction (p. 15)
2.2 Bulk Micromachining (p. 16)
2.2.1 Silicon on Silicon Bonding (p. 19)
2.2.2 Silicon on Glass (Anodic) Bonding (p. 20)
2.3 Surface Micromachining (p. 20)
2.3.1 Squeeze-Film Damping (p. 22)
2.3.2 Stiction (p. 23)
2.3.3 Particulate Control (p. 23)
2.3.4 Combinations of Surface and Bulk Micromachining (p. 24)
2.4 Other Micromachining Techniques (p. 25)
2.4.1 LIGA Process (p. 25)
2.4.2 Dry Etching Processes (p. 25)
2.4.3 Silicon Fusion Bonding (p. 27)
2.4.4 Lasers in Micromachining (p. 28)
2.4.5 Post Etching to Obtain Smarter Structures (p. 29)
2.5 Other Micromachined Materials (p. 33)
2.5.1 Diamond as an Alternate Sensor Material (p. 33)
2.5.2 Metal Oxides and Piezoelectric Sensing (p. 34)
2.5.3 Films on Microstructures (p. 34)
2.6 Summary (p. 35)
References (p. 35)
Chapter 3 The Nature of Semiconductor Sensor Output (p. 39)
3.1 Introduction (p. 39)
3.2 Sensor Output Characteristics (p. 39)
3.2.1 Wheatstone Bridge (p. 40)
3.2.2 Piezoresistivity in Silicon (p. 41)
3.2.3 Semiconductor Sensor Definitions (p. 43)
3.2.4 Static versus Dynamic Operation (p. 45)
3.3 Other Sensing Technologies (p. 46)
3.3.1 Capacitive Sensing (p. 46)
3.3.2 Piezoelectric Sensing (p. 46)
3.3.3 Hall Effect (p. 48)
3.3.4 Chemical Sensors (p. 49)
3.3.5 Improving Sensor Characteristics (p. 49)
3.4 Digital Output Sensors (p. 50)
3.4.1 Incremental Optical Encoders (p. 50)
3.4.2 Digital Techniques (p. 51)
3.5 Noise/Interference Aspects (p. 53)
3.6 Low-Power, Low-Voltage Sensors (p. 53)
3.6.1 Impedance (p. 54)
3.7 An Analysis of Sensitivity Improvement (p. 54)
3.7.1 Thin Diaphragm (p. 54)
3.7.2 Increase Diaphragm Area (p. 54)
3.7.3 Combined Solution: Micromachining and Microelectronics (p. 55)
3.8 Summary (p. 55)
References (p. 56)
Chapter 4 Getting Sensor Information into the MCU (p. 57)
4.1 Introduction (p. 57)
4.2 Amplification and Signal Conditioning (p. 57)
4.2.1 Instrumentation Amplifiers (p. 59)
4.2.2 Sleep-Mode Operational Amplifier (p. 59)
4.2.3 Rail-to-Rail Operational Amplifiers (p. 60)
4.2.4 Switched-Capacitor Amplifier (p. 64)
4.2.5 Barometer Application Circuit (p. 64)
4.2.6 A 4- to 20-mA Signal Transmitter (p. 65)
4.2.7 Schmitt Trigger (p. 65)
4.3 Separate versus Integrated Signal Conditioning (p. 65)
4.3.1 Integrated Passive Elements (p. 68)
4.3.2 Integrated Active Elements (p. 68)
4.4 Digital Conversion (p. 68)
4.4.1 A/D Converters (p. 70)
4.4.2 ADC Performance (p. 72)
4.4.3 ADC Accuracy/Error Implications (p. 74)
4.5 Summary (p. 74)
References (p. 75)
Chapter 5 Using MCUs/DSPs to Increase Sensor IQ (p. 77)
5.1 Introduction (p. 77)
5.1.1 Other IC Technologies (p. 77)
5.1.2 Logic Requirements (p. 78)
5.2 MCU Control (p. 79)
5.3 MCUs for Sensor Interface (p. 79)
5.3.1 Peripherals (p. 80)
5.3.2 Memory (p. 80)
5.3.3 I/O (p. 81)
5.3.4 Onboard A/D Conversion (p. 81)
5.3.5 Power-Saving Capability (p. 83)
5.3.6 Local Voltage or Current Regulation (p. 84)
5.3.7 Modular MCU Design (p. 85)
5.4 DSP Control (p. 85)
5.4.1 Algorithms versus Look-Up Tables (p. 88)
5.5 Techniques and Systems Considerations (p. 88)
5.5.1 Linearization (p. 89)
5.5.2 PWM Control (p. 89)
5.5.3 Autozero and Autorange (p. 90)
5.5.4 Diagnostics (p. 93)
5.5.5 EMC/RFI Reduction (p. 93)
5.5.6 Indirect (Computed not Sensed) versus Direct Sensing (p. 93)
5.6 Software, Tools, and Support (p. 94)
5.7 Sensor Integration (p. 94)
5.8 Summary (p. 96)
References (p. 97)
Chapter 6 Communications for Smart Sensors (p. 99)
6.1 Introduction (p. 99)
6.2 Background and Definitions (p. 99)
6.2.1 Background (p. 101)
6.3 Sources (Organizations) and Standards (p. 102)
6.4 Automotive Protocols (p. 103)
6.4.1 SAE J1850 (p. 103)
6.4.2 CAN Protocol (p. 105)
6.4.3 Other Automotive Protocols (p. 108)
6.5 Industrial Networks (p. 108)
6.5.1 Industrial Usage of CAN (p. 109)
6.5.2 LonTalk Protocol (p. 110)
6.5.3 Other Industrial Protocols (p. 110)
6.6 Office/Building Automation (p. 111)
6.7 Home Automation (p. 111)
6.7.1 CEBus (p. 112)
6.7.2 LonTalk (p. 112)
6.8 Protocols in Silicon (p. 113)
6.8.1 MCU with Integrated SAE J1850 (p. 113)
6.8.2 MCU with Integrated CAN (p. 113)
6.8.3 Neuron Chips and LonTalk Protocol (p. 118)
6.8.4 MI-Bus (p. 119)
6.8.5 Other MCUs and Protocols (p. 120)
6.9 Other Aspects of Network Communications (p. 120)
6.9.1 MCU Protocols (p. 121)
6.9.2 Transition between Protocols (p. 121)
6.9.3 The Protocol as a Module (p. 122)
6.10 Summary (p. 123)
References (p. 123)
Chapter 7 Control Techniques (p. 125)
7.1 Introduction (p. 125)
7.1.1 Programmable Logic Controllers (p. 125)
7.1.2 Open versus Closed-Loop Systems (p. 126)
7.1.3 PID Control (p. 126)
7.2 State Machines (p. 129)
7.3 Fuzzy Logic (p. 129)
7.4 Neural Networks (p. 133)
7.4.1 Combined Fuzzy + Neural (p. 135)
7.5 Adaptive Control (p. 136)
7.6 Other Control Areas (p. 137)
7.6.1 RISC versus CISC Architecture (p. 138)
7.6.2 Combined CISC, RISC, and DSP (p. 140)
7.7 Impact of Artificial Intelligence (p. 141)
7.8 Summary (p. 142)
References (p. 142)
Chapter 8 Transceivers, Transponders, and Telemetry (p. 145)
8.1 Introduction (p. 145)
8.1.1 The RF Spectrum (p. 146)
8.1.2 Spread Spectrum (p. 148)
8.2 Wireless Data and Communications (p. 150)
8.2.1 Wireless Local Area Networks (p. 151)
8.2.2 Fax/Modems (p. 151)
8.2.3 Wireless Zone Sensing (p. 152)
8.2.4 Optical Signal Transmission (p. 153)
8.3 RF Sensing (p. 153)
8.3.1 SAW (p. 154)
8.3.2 Radar (p. 155)
8.3.3 Global Positioning System (GPS) (p. 156)
8.3.4 Remote Emissions Sensing (p. 157)
8.3.5 Remote Keyless Entry (p. 158)
8.3.6 Intelligent Transportation System (p. 159)
8.3.7 RF-ID (p. 161)
8.3.8 Other Remote Sensing (p. 162)
8.3.9 Measuring RF Signal Strength (p. 163)
8.4 Telemetry (p. 163)
8.5 Summary (p. 165)
References (p. 166)
Chapter 9 Microelectromechanical Systems (MEMS) (p. 169)
9.1 Introduction (p. 169)
9.2 Micromachined Actuators (p. 169)
9.2.1 Microvalves (p. 170)
9.2.2 Micromotors (p. 171)
9.2.3 Micropumps (p. 173)
9.2.4 Microdynamometer (p. 175)
9.2.5 Actuators in Other Semiconductor Materials (p. 176)
9.3 Other Micromachined Structures (p. 176)
9.3.1 Cooling Channels (p. 176)
9.3.2 Micro-Optics (p. 177)
9.3.3 Microgripper (p. 178)
9.3.4 Microprobes (p. 179)
9.3.5 Micromirrors (p. 179)
9.3.6 Heating Elements (p. 180)
9.3.7 Thermionic Emitters (p. 180)
9.3.8 Field Emission Devices (p. 181)
9.3.9 Unfoldable Microelements (p. 182)
9.3.10 Micronozzles (p. 184)
9.3.11 Interconnects for Stacked Wafers (p. 184)
9.4 Summary (p. 185)
References (p. 185)
Chapter 10 Packaging Implications of Smarter Sensors (p. 187)
10.1 Introduction (p. 187)
10.2 Semiconductor Packaging Applied to Sensors (p. 187)
10.2.1 Increased Pin Count (p. 190)
10.3 Hybrid Packaging (p. 191)
10.3.1 Ceramic Packaging and Ceramic Substrates (p. 191)
10.3.2 Multichip Modules (p. 191)
10.3.3 Dual-Chip Packaging (p. 193)
10.3.4 Ball Grid Array Packaging (p. 194)
10.4 Packaging for Monolithic Sensors (p. 195)
10.4.1 Plastic Packaging (p. 196)
10.4.2 Surface-Mount Packaging (p. 196)
10.4.3 Flip-Chip (p. 196)
10.4.4 Wafer-Level Packaging (p. 198)
10.5 Reliability Implications (p. 199)
10.5.1 Wafer-Level Sensor Reliability (p. 202)
10.6 Summary (p. 203)
References (p. 203)
Chapter 1 Mechatronics and Sensing Systems (p. 205)
11.1 Introduction (p. 205)
11.1.1 Integration and Mechatronics (p. 205)
11.2 Smart-Power ICs (p. 206)
11.3 Embedded Sensing (p. 208)
11.3.1 Temperature Sensing (p. 208)
11.3.2 Current Sensing in Power ICs (p. 211)
11.3.3 Diagnostics (p. 211)
11.4 Sensing Arrays (p. 215)
11.4.1 Multiple Sensing Devices (p. 215)
11.4.2 Multiple Types of Sensors (p. 218)
11.4.3 An Integrated Sensing System (p. 218)
11.5 Other System Aspects (p. 219)
11.5.1 Batteries (p. 219)
11.5.2 Field Emission Displays (p. 220)
11.5.3 System Voltage Transients, ESD, and EMI (p. 220)
11.6 Summary (p. 222)
References (p. 222)
Chapter 12 The Next Phase of Sensing Systems (p. 225)
12.1 Introduction (p. 225)
12.2 Future Semiconductor Capabilities (p. 225)
12.3 Future System Requirements (p. 227)
12.4 Not-So-Future Systems (p. 228)
12.4.1 Fabry-Perot Interferometer (p. 228)
12.4.2 HVAC Sensor Chip (p. 229)
12.4.3 Speech Recognition and Micro-Microphones (p. 230)
12.4.4 Microgyroscope (p. 231)
12.4.5 MCU with Integrated Pressure Sensor (p. 231)
12.5 Software, Sensing, and the System (p. 231)
12.6 Alternate Views of Smart Sensing (p. 236)
12.7 Summary (p. 236)
References (p. 238)
Smart Sensor Acronym Decoder and Glossary (p. 241)
About the Author (p. 259)
Index (p. 261)

Author notes provided by Syndetics

Randy Frank received his B.S. and M.S. in Electrical Engineering, as well as his M.B.A. in Management, from Wayne State University in Detroit, Michigan.

Frank is Technical Marketing Manager with ON Semiconductor in Phoenix, Arizona. He is a member of the Society of Automotive Engineers and former chairman of its Sensors Standards Committee, and a member of the IEEE and its Sensor Terminology Taskforce. Author of over 200 technical papers,

050

Understanding smart sensors / Randy Frank.

By: Frank, Randy.

Enhanced descriptions from Syndetics:

Table of contents provided by Syndetics

Author notes provided by Syndetics

By: Frank, Randy .