MTU Cork Library Catalogue

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EMC for systems and installations / Tim Williams and Keith Armstrong.

By: Williams, Tim, 1954-.
Contributor(s): Armstrong, Keith, 1949-.
Material type: materialTypeLabelBookPublisher: Oxford ; Boston : Newnes, 2000Description: xiv, 312 p. : ill. ; 24 cm. + pbk.ISBN: 0750641673.Subject(s): Electromagnetic compatibilityDDC classification: 621.38224
Holdings
Item type Current library Call number Copy number Status Date due Barcode Item holds
General Lending MTU Bishopstown Library Lending 621.38224 (Browse shelf(Opens below)) 1 Available 00112384
General Lending MTU Bishopstown Library Lending 621.38224 (Browse shelf(Opens below)) 1 Available 00112385
Total holds: 0

Enhanced descriptions from Syndetics:

This is a guide for the system designers and installers faced with the day-to-day issues of achieving EMC, and will be found valuable across a wide range of roles and sectors, including process control, manufacturing, medical, IT and building management. The EMC issues covered will also make this book essential reading for product manufacturers and suppliers - and highly relevant for managers as well as technical staff.

The authors' approach is thoroughly practical - all areas of installation EMC are covered, with particular emphasis on cabling and earthing. Students on MSc and CPD programmes will also find in this book some valuable real-world antidotes to the academic treatises.

The book is presented in two parts: the first is non-technical, and looks at the need for EMC in the context of systems and installations, with a chapter on the management aspects of EMC. The second part covers the technical aspects of EMC, looking at the various established methods which can be applied to ensure compatibility, and setting these in the context of the new responsibilities facing system builders.

EMC for Systems and Installations is designed to complement Tim Williams' highly successful EMC for Product Designers.

Bibliography: p. 297-306 - Includes index.

Table of contents provided by Syndetics

  • Preface (p. xi)
  • Chapter 1 Introduction: the EMC needs of systems (p. 1)
  • The definition of electromagnetic compatibility (p. 2)
  • A description of EMC phenomena (p. 3)
  • The need for EMC (p. 8)
  • Control of emissions (p. 8)
  • Control of immunity (p. 9)
  • Safety aspects (p. 11)
  • Chapter 2 The EMC Directive's requirements for systems and installations (p. 13)
  • Introduction to the EMC Directive (p. 13)
  • Scope and purpose (p. 14)
  • Other CE marking directives (p. 17)
  • The meaning of the CE Mark (p. 18)
  • Applicability to systems and installations (p. 20)
  • The 1997 guidelines (p. 20)
  • Definitions of systems and installations (p. 26)
  • The "responsible person" (p. 27)
  • The "instructions for use" (p. 28)
  • Routes to compliance (p. 29)
  • Self certification to standards (p. 29)
  • Using the Technical Construction File (p. 31)
  • Does "CE + CE = CE?" (p. 34)
  • The "Procedural Approach" to compliance (p. 37)
  • Enforcement and the future of the EMC Directive (p. 38)
  • The UK situation (p. 38)
  • Other countries (p. 38)
  • The SLIM initiative (p. 40)
  • Chapter 3 Management of systems EMC (p. 43)
  • The EMC control plan (p. 43)
  • The EMC control board (p. 43)
  • Identifying EMC issues (p. 44)
  • Identifying and sourcing critical parts (p. 47)
  • Control of assembly and installation (p. 48)
  • The EMC test plan (p. 49)
  • Defining the configuration to be tested (p. 49)
  • Defining the tests to be done (p. 50)
  • Testing system modules (p. 50)
  • Testing the whole system (p. 50)
  • Documentation (p. 52)
  • Documentation for in-house use (p. 52)
  • Documentation for a TCF (p. 52)
  • Purchasing (p. 52)
  • Determining the EMC specifications for an incorporated item (p. 53)
  • Checking suppliers' evidence of EMC performance (p. 56)
  • Maintenance, upgrades and enhancements (p. 62)
  • Maintenance (p. 62)
  • The relevance of upgrades or enhancements (p. 63)
  • Training (p. 64)
  • Training and awareness check list (p. 64)
  • Chapter 4 Interference sources, victims and coupling (p. 67)
  • Phenomena in the electromagnetic environment (p. 67)
  • Examples of radiated field threats (p. 76)
  • Continuous radiated threats from radio transmitters (p. 77)
  • Coupling (p. 78)
  • Direct coupling (p. 78)
  • Near field (inductive and capacitive) coupling (p. 81)
  • Radiated coupling (p. 84)
  • The modes of coupling (p. 86)
  • Protection measures (p. 89)
  • Mains harmonics (p. 92)
  • Their causes and problems (p. 92)
  • Harmonic solutions (p. 95)
  • EMC versus safety (p. 96)
  • Filter problems (p. 97)
  • Screened enclosures (p. 99)
  • Chapter 5 Earthing and bonding (p. 101)
  • The concept and practice of earth (p. 101)
  • The purposes of the earth connection (p. 101)
  • Definitions of the EMC earth (p. 103)
  • Earthing techniques (p. 106)
  • The impedance of the earth connection (p. 112)
  • Impedance of wires (p. 112)
  • Effective bonding of joints (p. 115)
  • Creating the meshed facility earth (p. 123)
  • Constructing SRPPs and bonding mats for system blocks (p. 123)
  • Improving the earth-bonding of older buildings (p. 126)
  • Maintaining earth-bonding networks (p. 131)
  • Non-IT installations (p. 131)
  • Chapter 6 Cabinets, cubicles and chambers (p. 133)
  • The purpose of a metallic enclosure (p. 133)
  • Transfer impedance of the earth reference (p. 133)
  • Layout and placement within the enclosure (p. 134)
  • Shielding theory (p. 137)
  • Shielding effectiveness (p. 137)
  • The effect of apertures, seams and penetrations (p. 141)
  • Shielding techniques (p. 144)
  • Bonding structural components (p. 144)
  • Shielding hardware (p. 145)
  • Installation and maintenance of screened enclosures (p. 151)
  • Architectural shielding (p. 151)
  • Apertures (p. 152)
  • Chapter 7 Cabling (p. 155)
  • Coupling to, from and within cables (p. 155)
  • Differential mode (p. 155)
  • Common mode (p. 159)
  • Crosstalk (p. 163)
  • Cable screening techniques (p. 164)
  • Options for cable screening (p. 164)
  • Cable transfer impedance (p. 166)
  • Terminating the screen (p. 168)
  • Which end to earth? (p. 171)
  • Unscreened cables (p. 175)
  • Twisted pair (p. 176)
  • Ribbon cable (p. 178)
  • Installing cable systems (p. 179)
  • Cable classification (p. 179)
  • Segregation and routing (p. 184)
  • Parallel Earth Conductor (PEC) techniques (p. 188)
  • Chapter 8 Filtering (p. 193)
  • Attenuating noise at the interfaces (p. 193)
  • The low pass filter (p. 193)
  • Differential versus common mode in filters (p. 194)
  • Source and load impedances (p. 195)
  • Layout and installation (p. 197)
  • Mains filters (p. 200)
  • The operation of standard mains filters (p. 201)
  • Extending the performance of standard filters (p. 202)
  • Filtering other lines (p. 205)
  • Filtered connector adaptors (p. 206)
  • Using ferrites (p. 207)
  • Chapter 9 Lightning and surge protection (p. 211)
  • The EMC problems of lightning (p. 211)
  • How lightning phenomena can affect electronic apparatus (p. 211)
  • Overview of design of a lightning protection system (LPS) (p. 213)
  • Basic LPS design for safety and structural protection (p. 214)
  • Risk assessment (p. 214)
  • Construction of an LPS (p. 215)
  • Bonding external cables and metallic services to earth (p. 219)
  • Additional LPS measures to protect electronic apparatus (p. 220)
  • Enhancing the LPS structure (p. 221)
  • Protection of exposed equipment (p. 221)
  • Enhanced earthing and bonding (p. 222)
  • Cable routing and screen bonding (p. 225)
  • Use of isolation techniques and fibre-optics (p. 226)
  • Zoning and surge protection (p. 226)
  • Protecting from non-lightning surges (p. 233)
  • Chapter 10 In situ testing (p. 235)
  • Emissions (p. 235)
  • CISPR instrumentation and transducers (p. 235)
  • Conducted test methods (p. 246)
  • Radiated test methods (p. 249)
  • Practical aspects of in-situ emissions tests (p. 253)
  • Immunity (p. 257)
  • Practical aspects of immunity tests (p. 257)
  • Electrostatic discharge (p. 257)
  • Electrical fast transient bursts (p. 261)
  • Surges (p. 264)
  • Radiated and conducted RF (p. 266)
  • Appendix A Systems EMC procedures checklist (p. 275)
  • Company Procedures (p. 275)
  • Designers (p. 275)
  • Assemblers (p. 276)
  • User and Installation Manuals (p. 276)
  • Installation, commissioning, service (p. 277)
  • Appendix B Determining performance criteria (p. 279)
  • Appendix C Some published case studies (p. 285)
  • Segaworld (p. 285)
  • Air Traffic Services (p. 286)
  • VDU image problems in a steel rolling mill (p. 289)
  • Large explosion at the Texaco Refinery, Milford Haven, July 1994 (p. 290)
  • Wide area interference created by large inverter drives (p. 291)
  • Release of chlorine gas in semiconductor processing plant (p. 292)
  • Traction current interference to safety circuits (p. 292)
  • Appendix D The EU and EEA countries (p. 293)
  • The European Union (p. 293)
  • The European Economic Area (p. 293)
  • Glossary (p. 295)
  • Bibliography (p. 297)
  • Index (p. 307)

Author notes provided by Syndetics

Tim Williams worked for a variety of companies as an electronic design engineer, before startinghis own consultancy specializing in EMC design and test advice and training. He has monitored the progress of the EMC Directive and its associated standards since it was first made public, over the last 25 years.

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