Enhanced descriptions from Syndetics:

The Keep It Simple (KISS) philosophy is the primary focus of this book. It is written in very simple language with minimal math, as a compilation of helpful EMI troubleshooting hints. Its light-hearted tone is at odds with the extreme seriousness of most engineering reference works that become boring after a few pages. This text tells engineers what to do and how to do it. Only a basic knowledge of math, electronics, and a basic understanding of EMI/EMC are necessary to understand the concepts and circuits described.

Once EMC troubleshooting is demystified, readers learn there are quick and simple techniques to solve complicated problems a key aspect of this book. Simple and inexpensive methods to resolve EMI issues are discussed to help generate unique ideas and methods for developing additional diagnostic tools and measurement procedures. An appendix on how to build probes is included. It can be a fun activity, even humorous at times with bizarre techniques (i.e., the sticky finger probe).

Table of contents provided by Syndetics

• Preface (p. xiii)
• Acknowledgments (p. xvii)
• 1 Introduction (p. 1)
• 1.1 The Need to Comply (p. 1)
• 1.2 Definitions (p. 3)
• 1.3 Nature of Interference (p. 5)
• 1.4 Overview on Product Testing (p. 6)
• 1.4.1 Test Environment (p. 6)
• 1.4.2 Self-Compatibility (p. 8)
• 1.4.3 Validation of Measured Data (p. 9)
• 1.4.4 Problems during Emissions Testing (p. 10)
• 1.5 Time-Domain versus Frequency-Domain Analysis (p. 12)
• 1.6 EMC Testing Methodologies (p. 14)
• 1.6.1 Development Testing and Diagnostics (p. 15)
• 1.6.2 Compliance and Precompliance Testing (p. 15)
• References (p. 16)
• 2 Electric, Magnetic, and Static Fields (p. 17)
• 2.1 Relationship between Electric and Magnetic Fields (p. 17)
• 2.2 Methods of Noise Coupling (p. 22)
• 2.2.1 Common-Impedance Coupling (p. 24)
• 2.2.2 Electromagnetic Field Coupling (p. 25)
• 2.2.3 Conductive Coupling (p. 27)
• 2.2.4 Radiated Coupling-Magnetic Field (p. 27)
• 2.2.5 Radiated Coupling-Electric Field (p. 28)
• 2.2.6 Radiated and Conducted Coupling Combined (p. 31)
• 2.3 Common-Mode Currents versus Differential-Mode Currents (p. 32)
• 2.3.1 Differential-Mode Currents (p. 32)
• 2.3.2 Common-Mode Currents (p. 33)
• 2.3.3 Example on Difference between Differential- and Common-Mode Currents (p. 33)
• 2.3.4 Radiation due to Differential-Mode Currents (p. 36)
• 2.3.5 Common-Mode Radiation (p. 38)
• 2.3.6 Conversion between Differential- and Common-Mode Energy (p. 39)
• 2.4 Static Fields (p. 40)
• 2.4.1 Electrostatic Discharge Waveforms (p. 41)
• 2.4.2 Triboelectric Series (p. 41)
• 2.4.3 Failure Modes From a Static Event (p. 43)
• References (p. 46)
• 3 Instrumentation (p. 47)
• 3.1 Time-Domain Analyzer (Oscilloscope) (p. 47)
• 3.1.1 Oscilloscope Probes (p. 52)
• 3.2 Frequency-Domain Analyzers (p. 53)
• 3.2.1 Spectrum Analyzers (p. 57)
• 3.2.2 Receivers (p. 64)
• 3.3 Precompliance versus Compliance Analyzers (p. 66)
• 3.4 Correlation Analyzer (p. 68)
• 3.4.1 Characteristics of Cancellation System (p. 70)
• 3.4.2 Coherence Factor (p. 71)
• References (p. 75)
• 4 Test Facilities (p. 77)
• 4.1 Open-Area Test Sites (p. 78)
• 4.1.1 Requirements for an OATS (p. 78)
• 4.1.2 Test Configuration--System, Power, and Cable Interconnects (p. 85)
• 4.1.3 Operating Conditions (p. 87)
• 4.1.4 Measurement Precautions (p. 95)
• 4.1.5 Alternate Test Sites (p. 95)
• 4.2 Chambers (p. 96)
• 4.2.1 Anechoic Chamber (p. 97)
• 4.2.2 Screen/Shield Rooms (p. 104)
• 4.2.3 Reverberation Chamber (p. 107)
• 4.3 Cells (p. 109)
• 4.3.1 TEM Cell (p. 109)
• 4.3.2 GTEM Cell (p. 110)
• References (p. 112)
• 5 Probes, Antennas, and Support Equipment (p. 113)
• 5.1 Need for Probes, Antennas, and Support Equipment (p. 113)
• 5.2 Voltage Probes (p. 115)
• 5.3 Current Probes (p. 116)
• 5.3.1 Specifying a Current Probe (p. 118)
• 5.3.2 Limitations When Using Current Probes (p. 122)
• 5.4 LISN/AMN (AC Mains) (p. 124)
• 5.5 CDNs (Data and Signal Lines) (p. 128)
• 5.6 Absorbing Clamp (p. 130)
• 5.6.1 Test Setup and Measurement Procedure (p. 132)
• 5.7 Bulk Current Injection--Probe and Insertion Clamp (p. 134)
• 5.7.1 Choosing a BCI Probe (p. 135)
• 5.8 Basic Probe Types--Near Field and Closed Field (p. 137)
• 5.9 Sniffer Probes (p. 140)
• 5.9.1 Near-Field Probes (p. 142)
• 5.9.2 Commercial Probes (p. 143)
• 5.10 Differential-Mode Probes (p. 143)
• 5.11 Home-Made Probes (p. 146)
• 5.12 Alternate Troubleshooting Devices (p. 147)
• 5.13 Far-Field Antennas (p. 150)
• 5.13.1 Common Antennas Used for EMC Testing (p. 153)
• References (p. 156)
• 6 Conducted Testing (p. 157)
• 6.1 Overview of Conducted Currents (p. 157)
• 6.1.1 Common- and Differential-Mode Currents on Wires and Cables (p. 159)
• 6.1.2 Coupling Paths for Conducted Emissions (p. 161)
• 6.1.3 Conducted Emissions Test Requirements (p. 163)
• 6.2 Performing Conducted Current Tests (p. 163)
• 6.2.1 Engineering Investigation in Laboratory or Engineer's Office (p. 163)
• 6.2.2 Test Environment (p. 164)
• 6.3 Conducted Emissions Testing (AC Power Mains) (p. 164)
• 6.3.1 Potential Problems during Conducted Emission Testing (p. 166)
• 6.3.2 In Situ Testing of Systems and Installations (p. 167)
• 6.4 Immunity/Susceptibility Tests (p. 168)
• 6.4.1 Electrical Fast Transient and Burst Testing (p. 169)
• 6.4.2 Surges (p. 174)
• 6.4.3 Conducted RF Current Immunity (p. 181)
• 6.4.3.1 Coupling Methods (p. 181)
• 6.4.3.2 Typical Conducted Immunity Test Setup and Equipment (p. 184)
• 6.4.3.3 Performing Typical Conducted Immunity Test (p. 189)
• 6.4.3.4 Diagnosis and Fixes (p. 191)
• 6.4.4 AC Mains Supply Dips, Dropouts, and Interruptions (p. 192)
• 6.4.4.1 AC Mains Supply Sags/Brownouts (p. 195)
• 6.4.4.2 Swell Testing (p. 196)
• 6.4.4.3 Three-Phase Equipment--Compliance Testing (p. 198)
• 6.4.4.4 Diagnosis and Fixes (p. 198)
• 6.4.5 Power Line Harmonics (p. 199)
• 6.4.5.1 How Harmonics Are Created and Related Concerns (p. 200)
• 6.4.5.2 Diagnosis and Fixes (p. 211)
• 6.4.6 Voltage Fluctuation and Flicker (p. 211)
• 6.4.6.1 Description of Short-Term Flicker (p. 212)
• 6.4.6.2 Instrumentation (p. 213)
• References (p. 215)
• 7 Radiated Testing (p. 217)
• 7.1 Performing Radiated Tests (p. 218)
• 7.1.1 Engineering Investigation in Laboratory or Engineer's Office (p. 220)
• 7.1.2 Precompliance Testing (p. 220)
• 7.1.3 Performing Precompliance Analysis (p. 223)
• 7.1.4 Formal EMC Qualification Tests (p. 224)
• 7.1.5 Instrumentation Error (p. 225)
• 7.1.6 In Situ Testing of Systems and Installations (p. 227)
• 7.2 Immunity/Susceptibility Tests (p. 228)
• 7.2.1 Radiated Immunity (p. 229)
• 7.2.1.1 Modulation (p. 231)
• 7.2.1.2 Harmonic Issues (p. 233)
• 7.2.1.3 Monitoring of Immunity Field Level (p. 234)
• 7.2.2 Electrostatic Discharge (p. 234)
• 7.2.2.1 General Information (p. 235)
• 7.2.2.2 ESD Waveforms (p. 235)
• 7.2.2.3 Triboelectric Series (p. 236)
• 7.2.2.4 Typical Test Setup (p. 237)
• 7.2.2.5 EUT Performance Criteria (p. 241)
• 7.2.2.6 Diagnosis and Fixes (p. 241)
• 7.2.2.7 Concerns Related to Analyzing ESD Events (p. 242)
• 7.2.2.8 Alternative ESD Test Simulator (p. 243)
• 7.2.2.9 Other Uses for ESD Simulator (p. 244)
• 7.2.2.10 Sensing ESD Events within One's Environment (p. 245)
• 7.2.3 Power Frequency Magnetic Field Disturbance (p. 245)
• 7.2.3.1 General Conditions (p. 246)
• 7.2.3.2 EUT Performance Criteria (p. 246)
• 7.2.3.3 Typical Test Setup (p. 247)
• 7.2.3.4 Waveform Verification (p. 249)
• 7.2.3.5 Performing the Test (p. 249)
• References (p. 250)
• 8 General Approaches to Troubleshooting (p. 251)
• 8.1 General System Testing and Troubleshooting (p. 252)
• 8.1.1 Emission Testing (p. 253)
• 8.1.2 Immunity Testing (p. 255)
• 8.1.3 In Situ Testing (p. 256)
• 8.2 Potential Problems During Testing and Troubleshooting (p. 259)
• 8.3 Testing and Troubleshooting Concerns (p. 263)
• 8.3.1 Systematic Approach for Emission Testing and Troubleshooting (p. 264)
• 8.3.2 Systematic Approach for Immunity Testing and Troubleshooting (p. 266)
• 8.3.3 Systematic Approach to Detecting and Locating Problems (p. 267)
• 8.3.4 Minimum Requirements for Performing EMC Tests (p. 271)
• 8.4 Repeatability of System Testing (p. 272)
• 8.5 Unexpected Problems after Production Has Begun (p. 275)
• 8.6 Creative Approaches to Troubleshooting (Case Studies) (p. 276)
• References (p. 277)
• 9 On-Site Troubleshooting Techniques (p. 279)
• 9.1 Quick Fixes and Solutions (p. 280)
• 9.1.1 Conducted Solutions (p. 281)
• 9.1.2 Radiated Solutions (p. 287)
• 9.1.3 Crosstalk Solutions (p. 291)
• 9.2 Simplified Troubleshooting Techniques (p. 292)
• 9.2.1 The "Plain Wave and Standing Wave" Technique (p. 293)
• 9.2.2 The "Disabling-the-System" Technique (p. 293)
• 9.2.3 The "Cable Disconnection" Technique (p. 294)
• 9.2.4 The "Sticky Finger" Debugging Tool (p. 295)
• 9.2.5 The "Sharpen-Your-Pencil" Tool (p. 296)
• 9.2.6 The "Coolant Spray" Tool (p. 297)
• 9.2.7 The "Piece-of-Wire" Approach (p. 298)
• 9.2.8 The "Radio Control Race Car Diagnostic Sensor (p. 298)
• 9.2.9 The "Tin Can Wireless Antenna" for Signals above 1 GHz (p. 300)
• 9.3 Testing and Troubleshooting Using Probes (p. 301)
• 9.3.1 Using Probes for Immunity Testing and Troubleshooting (p. 301)
• 9.3.2 Differential Measurement of RF Currents on Cables and Interconnects (p. 305)
• 9.3.3 Switching Power Supply Effects on Common-Mode Conducted Noise (p. 308)
• 9.3.4 Discrete Component Diagnostic Tool (p. 310)
• 9.3.5 Tweezers Probe (p. 311)
• 9.3.6 Miniature High-Discrimination Probe (p. 312)
• 9.3.7 Using Current Probe as Substitute for Radiated Emission Testing (p. 313)
• 9.3.8 Enclosure Resonances and Shielding Effectiveness (p. 315)
• 9.4 Alternate Troubleshooting Techniques (p. 316)
• 9.4.1 Using Oscilloscope to Debug Signal Integrity Waveforms and Radiated Emissions (p. 316)
• 9.4.2 Using Inexpensive Receivers for Emissions Testing (p. 319)
• 9.4.3 Using Amateur Radio Transmitter for Immunity Testing (p. 321)
• 9.4.4 Radiated Problem Masked as Conducted Emission Problem (p. 322)
• 9.4.5 Determining Whether Conducted Emission Noise is Differential Mode or Common Mode (p. 323)
• 9.4.6 Another Use of EFT/B Generator (p. 324)
• 9.4.7 Signal Integrity Observations (p. 325)
• 9.5 System-Level Troubleshooting (p. 326)
• 9.5.1 Switching Power Supplies--Measuring Magnetic Field Coupling (p. 326)
• 9.5.2 Potential Problems When Using Ferrite Cores--Increase in Radiated Emissions (p. 328)
• 9.5.3 Measuring Shielding Effectiveness of Materials and Enclosures (p. 330)
• 9.5.4 Measuring Effects of High-Frequency Noise Currents in Equipment (p. 333)
• 9.5.5 Measuring Noise Voltage across Seams in Enclosures (p. 336)
• 9.6 Ambient Cancellation or Suppression (p. 339)
• 9.7 Printed Circuit Board Diagnostic Scanners (p. 341)
• References (p. 345)
• Appendix A Building Probes (p. 347)
• Appendix B Test Procedures (p. 375)
• Glossary (p. 435)
• Bibliography (p. 447)
• Index (p. 453)
• About the Authors (p. 459)

Author notes provided by Syndetics

EDWARD M. NAKAUCHI has over thirty years of experience in analog, power, and digital design and has spent the majority of the past twenty years working in the EMI/EMC/EMP and ESD areas for military aerospace companies as well as commercial audio, computer, and medical organizations. He has written numerous technical papers and magazine articles, and presented seminars on various EMI/EMP/ESD topics. He has also taught courses on EMI/EMC through the University of California Irvine Extension program. He is a NARTE certified EMC/ESD engineer and an IEEE Senior Member.