Includes index.

Introduction -- New developments in materials and processes in silicon device technology -- Materials for conductor elements and connections to thin films -- Adhesive bonding of microelectronic packages -- Application of film materials and components -- Encapsulation materials: plastics -- Encapsulation compatibility -- Rubber seal materials -- Fire-retardant thermoplastic and thermosetting materials -- Structural adhesive materials -- Tubing and sleeving materials -- Connector materials -- Metallised ceramic materials -- Protective coatings for metals -- Multilayer alumina circuit boards -- Steatite and alumina insulators -- Sealing expansion alloys -- Metal plating -- Electronic packaging processes with plastics -- Preparing surfaces for adhesives -- Packaging electronic components -- Plating multilayer printed wiring boards -- Plated through-hole process -- Electrical wiring processes for panels, junction boxes and electronic equipment -- Cable lacing -- Shrinkable sleeve assembly -- Etching, cleaning and preparation -- Flexible cables, printed wiring, printed circuits -- Materials aspects in microelectronics devices -- Wafer exposure -- Surface analytical techniques applied to electronic components -- Modern physics in semiconductor processing -- Microelectronic processing technology -- Failure mechanisms and analysis procedures for semiconductor devices.