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MARC view
Wire bonding (Electronic packaging) (Topical Term)
This authority is not used in any records.
Used for/see from:
- Lead bonding (Electronic packaging)
- Wirebonding (Electronic packaging)
See also:
- Broader heading: Electronic packaging
- Broader heading: Metal bonding
Work cat.: Harman, G.G. Wire bonding in microelectronics, 1997: CIP introd (primarily concerned with ... chip-to-package wire bonds ...)
ASTI on FirstSearch, May 19, 1997 (subject term: Wire bonding)
INSPEC on FirstSearch, May 19, 1997 (in title: Wirebonding, descriptor term: lead bonding)
Electronics engineers' handbook, c1990: pp. 8-79 (lead bonding)
Encyc. of electronics, 1990; The new IEEE standard dict. of electrical and electronics terms, 1992
Here are entered works on processes used to connect package leads to an integrated circuit.